NXP Semiconductors Netherlands B.V.

High Tech Campus 60

5656 AG Eindhoven

Phone: +31 40 2729960

Web: www.nxp.com

NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets. Built on more than 60 years of combined experience and expertise, the company has 45,000 employees in more than 35 countries

NXP Semiconductors Netherlands B.V. articles

Displaying 101 - 108 of 108

Let your Automotive Electronics do the talking

NXP Semiconductors, your partner in Automotive Networking (FlexRay, CAN, LIN)
8th February 2011

NXP in Automotive Telematics

NXP Semiconductors, your partner in Automotive Telematics (Road pricing, eCall, ATOP, On Board Unit, OBU)
8th February 2011

Experience NXP in Automotive

NXP Semiconductors, Leader in High Performance Mixed Signal solutions, experience NXP's Automotive capabilities
8th February 2011

NXP System Basis Chips Bring New Levels of Performance to In-Vehicle Networks

NXP Semiconductors today announced the release of the UJA107x family, its second generation of CAN/LIN System Basis Chips (SBCs) for in-vehicle networks. The UJA107x SBCs optimize the performance, power consumption and cost of electronic control units (ECUs) for a broad range of automotive applications, such as body control modules, climate control, seat control, electric power steering (EPS), adaptive lighting, rain/light sensors, parking assistance and transmission.
24th January 2011

Next-Generation NXP System Basis Chips Address Stringent EMC Requirements of Global Car OEMs

NXP announced the release of the UJA107xA family, its next generation of CAN/LIN System Basis Chips (SBCs) for in-vehicle networks. Offering enhanced EMC (Electromagnetic Compatibility) performance, the chips meet the stringent requirements of global car OEMs such as Audi, BMW, Daimler, Ford, Porsche, Renault, Toyota and Volkswagen.
24th January 2011

NXP to develop cutting-edge automotive-qualified 3.5G telematics solution to improve traffic management in Singapore

NXP Semiconductors N.V. today announced that it is developing a cutting-edge automotive-qualified 3.5G telematics solution to improve traffic management, which can help address the challenge of traffic congestion in Singapore. Expected to be deployed in 2012, NXP will develop innovative technologies based on NXP’s next-generation Automotive Telematics On-board Platform (ATOP). Singapore will be a test bed for ATOP, leveraging the city’s world-class infrastructure to deliver real-time information via mobile broadband and help reduce traffic congestion.
24th January 2011

Pan-European eCall Trial of NXP and Partners Concludes in Brussels

This week sees the successful conclusion of a field trial designed to prove that the European emergency call system ‘eCall’ for vehicles is ready for mass deployment across Europe. The trial, which was initiated by NXP Semiconductors N.V., involved major industry players including BMW, IBM, Allianz OrtungsServices, Deutsche Telekom, Dekra, and European automobile clubs such as Touring, ANBW, AvD, and UAMK. Three cars equipped with NXP’s telematics solution ATOP (Automotive Telematics On-Board Unit Platform) drove a total of 16,000 kilometers through sixteen different EU countries. During a two-week period, the telematics boxes sent out 15,000 eCalls via the mobile networks of Deutsche Telekom and its roaming partners; the eCalls were received and processed by IBM, Allianz OrtungsServices, and BMW servers or call centers.
24th January 2011

NXP - First All-in-One Digital One-Chip for Automotive Radio Digital

Today NXP Semiconductors announced the industry’s first RFCMOS-based, all-in-one digital chip for automotive radio applications. The TEF663x integrates AM/FM radio and audio signal post-processing functions in a single integrated circuit (IC). Until now, the tuner, radio DSP and audio post-processing DSP cores were separate ICs.
24th January 2011

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