NXP Semiconductors Netherlands B.V.

Address:
High Tech Campus 60

5656 AG Eindhoven
Netherlands

Phone: +31 40 2729960

Web: www.nxp.com

NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets. Built on more than 60 years of combined experience and expertise, the company has 45,000 employees in more than 35 countries


NXP Semiconductors Netherlands B.V. articles

Displaying 1 - 20 of 107

The autonomous car of the future

Ultimate flexibility - the Rinspeed MicroSnap shows what's possible when the pod separates from the chassis.
4th February 2019

Power your in-vehicle communication network

According to NXP, Kinetis KW36/35 wireless MCUs is the industry's first automotive‐qualified Bluetooth 5 family of MCUs with CAN‐FD.
10th October 2018

Simplify your system design and reduce time to market

The S12 MagniV portfolio helps simplify system design with easy-to-use, expertly integrated mixed-signal MCUs for automotive applications.
26th July 2018


Partnership for the connected car of the future

Partnership for the connected car of the future
NXP Semiconductors N.V. and HARMAN International have expanded their 15-year collaboration to speed up time-to-market for connected car solutions. Connected car systems are key decision drivers for consumers accustomed to the rich user experiences they encounter in their everyday digital lives. The resulting expectations have triggered a transformation in infotainment systems from bulky, purpose-built devices into sleek, connected, upgradeable and integrated platforms.
26th June 2017

Cooperation agreement encourages connected car innovation

In order to foster innovation in intelligent transportation and securely connected vehicles, NXP Semiconductors and China Academy of Information and Communications Technology (CAICT), a subsidiary of China’s Ministry of Industry and Information Technology (MIIT), signed a strategic cooperation agreement. CAICT Communication Standards Research Institute Director, Wang Zhiqin and NXP Global Senior Vice President and President of Greater China, Zheng Li signed the agreement under the witness of MIIT Electronic Information Department Integrated Circuit Division Director, Ren Aiguang in Shenzhen, China.
12th April 2017

Automotive software design accelerates with microcontroller platform

Automotive software design accelerates with microcontroller platform
At embedded world last week, NXP Semiconductors launched the S32K1 family combining a breakthrough suite of automotive grade tools and software in support of a scalable family of ARM Cortex-based MCUs with future-proof features. This combination drastically reduces development effort and time to market in a broad range of automotive applications. With 10 of the top 15 global car manufacturers already using S32K in next generation vehicles, this platform sets the future direction of automotive ECU development.     
20th March 2017

Lorries platoon in Munich to demo secure transport system

Lorries platoon in Munich to demo secure transport system
To demonstrate the progress of secure intelligent transport systems NXP Semiconductors and its partners have been platooning live on Munich roads, and demonstrating traffic signal and vehicle synchronisation, and technology that protects vulnerable road users based on secure vehicle-to-everything technology (V2X). NXP and DAF Trucks have also announced plans to empower truck platoons to react 30 times faster than humans in 2017.
16th November 2016

NXP and DAF Trucks commit to benchmark in truck platooning

NXP Semiconductors N.V. and its partners are showcasing the progress of secure intelligent transport systems in advance of this year’s electronica show in Munich. The demonstrations include platooning live on Munich roads, traffic signal and vehicle synchronisation, and technology that protects vulnerable road users based on secure vehicle-to-everything technology (V2X). NXP and DAF Trucks have also announced plans to empower truck platoons to react 30 times faster than humans in 2017.
9th November 2016

Automotive radar MCUs make safe automated driving a reality

An automotive radar microcontroller (MCU) has been announced by NXP Semiconductors. The NXP S32R27 will deliver the features and performance required for making safe, automated driving a reality.  An estimated 50% of all car radar modules shipped in 2016 will utilise NXP radar processing and front-end technology.
7th November 2016

Radar sensors allows autonomous cars to reliably sense environment

Radar sensors allows autonomous cars to reliably sense environment
CompactRadar Sensors based on highly innovative RFCMOS radar system chips from NXP Semiconductors, have been announced by HELLA, setting a benchmark in 77GHz technology. Highly robust, weatherproof radar-based systems are gaining traction as a key way to implement a wide range of safety and comfort functionalities in cars. 
4th August 2016

Transport technologies supplied for Korean Government’s pilot project

NXP Semiconductors and eSSys have announced that they will be technology partners in Korea’s next gen Cooperative Intelligent Transportation System (C-ITS) project promoted by the Korean Ministry of Land, Infrastructure and Transport. NXP will supply eSSys with its RoadLINK V2X chipset, a vehicle-to-vehicle and vehicle-to-infrastructure (V2X) communication and security solution which will be test-operated on an 87.8km route between Sejong City (city of government offices) and Daejon. The year-long pilot operation begins July 2016.
20th July 2016

Field trial with over 100 military vehicles tests RFID technology

Field trial with over 100 military vehicles tests RFID technology
NXP Semiconductors and Tönnjes and Kirpestein B.V. have, after 12 months of testing in various weather conditions, with over 100 assorted military vehicles and at different speeds, presented the results of the first field trial with IDePLATEs (license plates). The field trial confirmed the secure, robust, effective, and reliable use of RFID technology for vehicle identification. 
14th July 2016

First large scale road test for smart vehicles launched in China

First large scale road test for smart vehicles launched in China
  The launch and implementation of China’s first ever large-scale road test initiative for intelligent connected vehicles through the NXP-Tongji University Joint Lab is to be supported by NXP Semiconductors and Tongji University.
6th July 2016

GaN transistors suit electronic warfare & battlefield comms

Expanding its portfolio of broadband GaN RF power transistors for electronic warfare and battlefield radio applications, NXP Semiconductors has announced six driver or final-stage amplifiers that have frequency coverage as broad as 1 to 3,000MHz.
26th May 2016

Connected car power package gets shrunk

Connected car power package gets shrunk
  A line of automotive power MOSFETs housed in a compact, thermally enhanced Loss Free PAcKage (LFPAK) has been introduced by NXP Semiconductors.
24th May 2016

NXP demonstrates complete autonomous vehicle platform

Marking a significant milestone in the fast-approaching self-driving vehicles era, NXP Semiconductors has demonstrated a comprehensive and highly manufacturable autonomous vehicles platform leveraging NXP’s BlueBox engine and deploying NXP silicon and software solutions at each ADAS node. The system demonstration incorporates the BlueBox central computing engine, together with radar, lidar, and vision sensing, as well as an onboard secure V2X system – all of which are powered by NXP silicon currently in volume production or sampling to customers now.
17th May 2016

Multi-channel LED driver ICs enable advanced automotive lighting

Addressing the growing industry demand for a cost-effective, flexible and scalable platform architecture to enable existing and emerging LED lighting features, NXP Semiconductors has announced its multi-channel LED driver IC portfolio for automotive exterior lighting. The two families, the multiphase boost ASLx500 and multichannel buck ASLx416 driver ICs, are both based on NXP's automotive qualified ABCD9 technology - a platform for mixed-signal, high-voltage integration.
9th May 2016

Brushed DC motor drivers for functionally safe vehicle electrification

NXP Semiconductors has introduced the HB2000 and HB2001 advanced brushed DC motor drivers. These motor drivers target automotive applications that require functionally safe vehicle electrification like throttle control, cruise control, turbo flaps and fuel flaps.
13th April 2016

Aerospace communications boosted for defense systems

Aerospace communications boosted for defense systems
NXP Semiconductors N.V. has set a benchmark in RF power performance with four new LDMOS transistors. The new transistors aim to deliver best-in class performance for defense radar and Identification Friend or Foe (IFF) systems operating between 900 and 1400MHz. Several defense contractors are currently developing and evaluating systems with these high capability transistors. 
12th April 2016

University of Sheffield ready to challenge Europe in NXP Cup Final

University of Sheffield ready to challenge Europe in NXP Cup Final
The 5th April saw young UK scientists compete at the Imperial College, London, in the UK Qualification round of The NXP Cup Challenge 2016. The Winning team and its two best contenders will compete at the European NXP Cup final in Munich, 9th-10th May.
8th April 2016


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