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NXP Semiconductors Netherlands B.V.

NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets. Built on more than 60 years of combined experience and expertise, the company has 45,000 employees in more than 35 countries

NXP Semiconductors Netherlands B.V. Articles

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News & Analysis
4th November 2021
Enabling face recognition even in challenging lighting

NXP Semiconductors has utilised a microcontroller and 3D camera to enable face recognition that is secure and resistant to poor lighting and facial recognition spoofing.

Artificial Intelligence
3rd November 2021
NXP enables 3D face recognition for secure access control

NXP has announced the expansion of its NXP EdgeReady portfolio, adding a solution for secure face recognition that leverages a high-performance 3D structured light module (SLM) camera combined with the i.MX RT117F crossover MCU.

Automotive
Sponsored
2nd November 2021
The Future of Automotive Connectivity

The automotive industry is experiencing an unprecedented transformation as it takes on the transition to electric, increasingly autonomous, and connected vehicles. Among these automotive megatrends, automotive connectivity stands at the forefront of vehicle design decisions, thanks to its central role in enabling a wide range of innovative user experiences, value-added services, safety and security enhancements, and new features that are changi...

Automotive
26th October 2021
NXP launches RTD software for AUTOSARTM and non-AUTOSAR

Delivering on its promise to tackle the cost and complexity of automotive software development, NXP has released its real-time drivers (RTD) software supporting all S32 automotive processors featuring Arm Cortex-M or Cortex-R52 cores.

Wireless
25th October 2021
New automotive wireless charging reduces risk from uncertified products within the market

New NXP automotive wireless charging reference design is the first to be certified by the Wireless Power Consortium for the new Qi 1.3 standard

Industrial
18th August 2021
3 ways not to screw up an eSIM design

After remaining essentially unchanged for more than 25 years, the Subscriber Identity Modules (SIMs) used to authenticate devices onto cellular networks are undergoing a dramatic transformation, moving from physical hardware to downloadable software – embodied by the concept of eSIMs. Cyril Caillaud, NXP Semiconductors, explains.

Latest
15th July 2021
Collaboration to extend connected vehicle insurance

NXP Semiconductors and MOTER Technologies have announced a secure data exchange platform that links deep data from connected vehicles to the insurance industry to power data science solutions for risk assessment, cost modeling, and more.

5G
30th June 2021
NXP brings GaN to 5G multi-chip modules

NXP Semiconductors has announced a milestone for 5G energy efficiency with the integration of Gallium Nitride (GaN) technology to its multi-chip module platform. Building on the company’s investment in its GaN fab in Arizona, NXP has announced RF solutions for 5G massive MIMO that combine the high efficiency of GaN with the compactness of multi-chip modules.

Wireless
28th June 2021
4 myths about UWB, debunked

Like any emerging technology, the myths around UWB hit the headlines almost as fast as the facts, and sometimes linger on in our memories. We asked several UWB ecosystem players to weigh in on the misconceptions they see attending UWB now and in the future as the technology becomes more accessible. Let’s demystify four misunderstandings about UWB. Guest blog written by Peter Pirc, UWB Solution Manager at NXP.

Communications
8th June 2021
Tools enable ultra-wideband applications for Apple

NXP Semiconductors has announced that it now offers beta Ultra-Wideband (UWB) development tools from its NXP Trimension portfolio that interoperate with the U1 chip in supported Apple products. The beta development tools will allow developers to kick-start the design of innovative applications that interact with UWB enabled Apple products including iPhone and Apple Watch, unleashing the ability to create more precise, directionally aware app expe...

Design
3rd June 2021
NXP launches processors on TSMC 16nm FinFET technology

NXP Semiconductors and TSMC has announced the release of NXP’s S32G2 vehicle network processors and the S32R294 radar processor into volume production on TSMC’s advanced 16 nanometer (nm) FinFET process technology.

Communications
3rd June 2021
Trimension ultra-wideband tech finds misplaced belongings

NXP Semiconductors announced that its Trimension Ultra-Wideband platform now offers fine ranging for new tagging use cases. UWB and Bluetooth Low Energy solutions have been combined to deliver spatial awareness to the new Samsung Galaxy SmartTag+, providing an enhanced experience to the Samsung SmartThings Find service.

IoT
29th April 2021
QFN solution to enable WiFi 6/6E in smartphones

OnePlus has selected NXP’s QFN RF Front End Solution for WiFi 6 for its latest high-end flagship smartphone, the OnePlus 9 featuring WiFi 6. NXP’s highly integrated QFN Front End Solution for WiFi 6/6E. The QFN solution supports the latest WiFi 6 wireless network standard and supports new 6GHz spectrum.

Blog
1st April 2021
The process of restarting a semiconductor facility

NXP is a member of the Austin, Texas community, and currently employs approximately 4,000 people and operating two wafer fabrication (fab) semiconductor facilities located at opposite ends of Austin: Oak Hill and ATMC. On February 15th, many of our operations team members braved heavy snow and dangerous driving conditions to make their way to the facilities, which run 24 hours a day, 7 days a week to keep the supply of products flowing. By Steve...

Communications
25th February 2021
CC-Link IE time-sensitive networking for automation

NXP has announced its integrated Time-Sensitive Networking (TSN) solutions for industrial automation that now support the CC-Link IE TSN protocol, combining gigabit Ethernet bandwidth with TSN to strengthen time sharing communication, performance, security and functionality for industrial Ethernet.

IoT
4th February 2021
EdgeLock 2GO IoT cloud platform for connected devices

NXP Semiconductors has introduced its new EdgeLock 2GO IoT service platform for easy, secure deployment and management of IoT devices and services. The new IoT security platform is integrated with NXP’s Common Criteria (CC) EAL 6+ certified EdgeLock SE050 secure element to protect IoT devices at the edge and securely connect them to one or multiple clouds and service providers.

Wireless
2nd February 2021
The era of the ‘Internet of Boxes’

The increasing strides made by technology are helping to advance our society in innumerable ways. Whether it is the tech being using at the coalface of vaccine development in the ongoing fight against the coronavirus pandemic, or the increasing drive towards autonomous vehicles within the automotive sector, technology is playing its part.

Communications
19th January 2021
6GHz spectrum unlocked with a WiFi 6E Tri-Band chipset

NXP Semiconductors has announced it is laying the foundation for a new era of WiFi 6 devices that can operate in the 6GHz band with its new CW641 WiFi 6E Tri-Band system-on-chip (SoC). With increasing congestion in the legacy 2.4GHz and 5GHz bands, the US FCC has approved 1.2GHz of unlicensed spectrum for the 6GHz band along with other regions around the world, which will transform the WiFi landscape.

Design
15th January 2021
BlueBox 3.0 for automotive high-performance computing

NXP Semiconductors has announced BlueBox 3.0, a new and expanded version of NXP’s safe Automotive High-Performance Compute (AHPC) development platform. Designed for software application development and validation ahead of silicon device availability, BlueBox 3.0 now offers a flexible way to address user-defined vehicles, safety Level 2+ (L2+) automated driving, and the evolving vehicle architectures that will revolutionise connected vehicle...

Wireless
6th January 2021
COVID-19 sparks a rise in biometric contactless payment

The COVID-19 pandemic has had ramifications everywhere, for almost – if not all – the industries in the world. Contactless payment existed before coronavirus hit, but it worked alongside cash and chip-and-pin. However, the pandemic has seen a considerable increase in the amount of transactions using contactless payment. Because of this, biometric payment cards – significantly more secure than standard contactless cards – a...

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