Design
Non-cytotoxic epoxy withstands multiple methods of medical sterilisation
Master Bond EP41S-5Med is a two-part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity and can be used for bonding, sealing, and coating in medical devices.
Two component adhesives market To Hit $7 Bn By 2033
According to a newly published research report by Fact.MR, a provider of market research and competitive intelligence, the two component adhesives market is predicted to increase at a CAGR of 7.2% from 2023 to 2033.
ShortLink AB joins X-FAB Design & Supply Chain Partner Network
ShortLink Ab has announced its listing on 'X-Chain' – the X-FAB Design & Supply Chain Partner Network. ShortLink offers turnkey ASIC development from initial concept through development up to and including mass production supply chain management.
IPC design competition champion crowned
Last week at IPC APEX EXPO in San Diego, Calif, five competitors squared off to determine who was the best of the best at PCB design.
DELO develop line lamp for curing adhesives
DELO has developed a line lamp for curing adhesives and other multi-functional polymers.The lamp offers high curing speeds and great flexibility for integration into production lines, like those found in consumer electronics assembly, the company claim. It can also be used, for example, in the lamination of thin-film solar cells.
Digital options for product configuration
Device manufacturers face a large range of options when creating the interface between their product and a signal source, a remote point of testing or tooling point.
New version of Flex Power Designer Software released
Flex Power Modules has released version 4.5 of their popular ‘Flex Power Designer’ (FPD) Tool which enables detailed simulation, configuration and optimisation of power systems using the company’s DC/DC converter products.
UMC and Cadence collaborate on 3D-IC hybrid bonding reference flow
United Microelectronics Corporation (UMC) and Cadence have announced that the Cadence 3D-IC reference flow has been certified for UMC’s chip stacking technologies, enabling faster time to market.
Long-term support for parallel PCI bus to remain assured
At Embedded World 2023, EKF Elektronik will be launching two new 3U CompactPCI processor boards with 11th generation Intel Core and Xeon processors (codename Tiger Lake H45).
Line lamp from DELO offers high intensity and flexibility in adhesive curing
DELO, global specialist manufacturer of industrial adhesives for automotive, consumer electronics and semiconductor industries, has developed a line lamp for curing adhesives and other multi-functional polymers.