Design
Low-temperature lead-free solder paste for high-speed printing
SHENMAO America, Inc. has released its PF735-PQ10-10L low melting point lead-free solder paste. The paste has been designed specifically for the SMT process and is applicable to the high-speed printing process to increase production capacity.
Molex releases Miniaturisation Report
Molex has released a report on miniaturisation in product design that highlights the cross-disciplinary engineering design and manufacturing expertise required to integrate an onslaught of increasingly sophisticated features and functionality into constantly shrinking device footprints.
The world’s first, and fastest, crewed flying car is unveiled
Alauda Aeronautics is seeking OEM partners to join it in a motorsport revolution, as it unveils the Airspeeder Mk4 – the world’s first, and fastest, crewed flying car.
STMicroelectronics expand STM32U5 series
STMicroelectronics has expanded its STM32 family of advanced microcontrollers (MCUs) with extra STM32U5 devices that raise performance while squeezing power consumption for longer runtimes and energy efficiency. The STM32U5 has also received NIST embedded random-number entropy source certification1; the industry’s first to receive this endorsement.
Oriental Motor enhances BLV-R motor driver design
The BLV-R series of BLDC motors and drivers have been redesigned to improve parameters such as speed and stability, while significantly reducing size and power consumption.
Unprecedented stability at 600x magnification on new digital microscope from TAGARNO
TAGARNO’s new FRONT digital microscopes solve a common problem for microscope operators: interference from nearby vibrations. With its unique design, FRONT significantly reduces camera movements caused by someone walking past the microscope station or vibrations from a nearby machine, creating an excellent user experience.
Cadence delivers 13 new VIPs and expands system portfolio
Cadence Design Systems has announced the availability of 13 new Verification IP (VIP) solutions that enable engineers to quickly and effectively verify their designs to meet the specifications for the latest standards protocols.
Leader Tech's thermal gap fillers address difficult thermal demands
Leader Tech is proud to announce its range of thermal gap fillers from 1.00W/m-K to 24.00W/m-K.
element14 and Amphenol launch Experimenting with Waterproof Connectors Design Challenge
element14, an Avnet community, has announced the Experimenting with Waterproof Connectors Design Challenge, the first community challenge of the new year.
Bostik presents a new instant adhesives precision dispensing system
The R&D team at Bostik’s Born2Bond engineering adhesives brand has revealed details of a new precision dispensing system at the in-adhesives symposium, which enables the easier use of cyanoacrylate adhesives in high-precision robotic manufacturing to bond automotive and electronics product parts with complex shapes and geometries.