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X-FAB Semiconductor Foundries AG

X-FAB Semiconductor Foundries AG Articles

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Power
27th May 2015
X-FAB Silicon Foundries & Exagan collaborate

X-FAB Silicon Foundries and Exagan have entered into a joint development agreement to industrialise Exagan’s GaN-on-silicon technology, begin producing high-speed power switching devices on 200mm wafers and establish a European production centre where the two partner companies will manufacture GaN devices for the solar, industrial, automotive and IT electronics. The two companies already have begun to demonstrate their capabilities by proce...

Optoelectronics
30th April 2015
0.18 & 0.35μm UV photodiodes offer high quantum efficiency

X-FAB Silicon Foundries has announced the expansion of its 0.18 and 0.35μm device portfolio with highly sensitive ultraviolet photodiodes, the first of its kind developed by a silicon foundry. Easily integrated into designs implemented in X-FAB’s modular XH018 and XH035 CMOS process technologies, X-FAB says that the diodes provide the highest quantum efficiency available from a silicon foundry.

Analysis
24th November 2014
Partnership targets Korean market with automotive sensor

X-FAB Silicon Foundries and Silicon Works jointly announced that they have reached a milestone in their strategic partnership to bring automotive sensors to the Korean market and replace current devices with domestic solutions. Mass production of their first device, a signal processing IC, is underway at X-FAB’s 200mm facility in Kuching, Malaysia.

Analysis
27th June 2014
X-FAB Expands MEMS Manufacturing Capabilities

X-FAB Silicon Foundries has announced it has reached a major milestone in further expanding its MEMS manufacturing capabilities in two of its German locations, Erfurt and Itzehoe. Driven by increased customer demand for MEMS manufacturing services, the expansion includes two new dedicated MEMS fabs with cleanroom space totaling more than 2,000 m2.

Analysis
20th June 2014
X-FAB Expands MEMS Manufacturing Capabilities

X-FAB Silicon Foundries has announced it has reached a major milestone in further expanding its MEMS manufacturing capabilities in two of its German locations, Erfurt and Itzehoe.

Design
27th June 2013
X-FAB Introduces New Analog/Mixed-Signal Reference Kit for Rapid Adoption of Advanced Cadence Design Flows

X-FAB Silicon Foundries today announced its new A/MS Reference Kit supporting advanced methodology for analog/mixed-signal design. The Kit enables rapid adoption of constraint-driven design, mixed-signal simulation, floorplanning, schematic-driven layout, automated routing, timing-driven digital block implementation and signoff.

Mixed Signal/Analog
18th June 2013
X-FAB Optimizes 180nm Process for Portable Analog Applications

X-FAB Silicon Foundries today announced it has enhanced the XP018 process with multiple options to lower chip costs for high-performance analog applications such as audio, sensor interface and 5V-environment power management applications.

Memory
7th November 2012
X-Fab and Anvo collaborate to offer Non-Volatile Memory Solutions

X-FAB Silicon Foundries and Anvo-Systems Dresden today announced a cooperative agreement to offer high-speed non-volatile memory solutions that combine SRAM, DRAM and SONOS FLASH technologies; the compact design results in a small silicon footprint that keeps device costs low.

Automotive
20th March 2012
X-FAB Extends High-Temperature Capability to 0.18 Micrometer Platform for Unique Combination of High Voltage, High Temperature and NVM Features

Responding to its customers’ needs for applications with high-temperature requirements, X-FAB Silicon Foundries today announced XH018 HT – a new module that adds high-temperature capability to its XH018 technology family. It offers the industry’s first and only 0.18 micrometer platform with high temperature (HT), high voltage (HV) and non-volatile memory (NVM) capability. X-FAB also added 13 new primitive devices with this extension, includ...

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