X-FAB Silicon Foundries SE, an analog/mixed-signal and specialty foundry, has introduced a near-infrared version of its single-photon avalanche diode (SPAD) device portfolio.

X-FAB Silicon Foundries SE, the analog/mixed-signal and specialty foundry, is making further significant progress with its galvanic isolation technology.

X-FAB Group is set to receive subsidies as part of the new Important Project of Common European Interest in Microelectronics and Communication Technologies (IPCEI ME/CT).

X-FAB Silicon Foundries has added to its broad proficiency in RF by announcing new integrated passive device (IPD) fabrication capabilities at European Microwave Week in Berlin (17 to 22 September).

X-FAB Silicon Foundries SE says it has built on its position in BCD-on-SOI technology, by being the first foundry to introduce a 110 nm solution.

X-FAB has intreduced its180-nanometre BCD (bipolar-CMOS-DMOS) on SOI (silicon on insulator) technology that supports an operating voltage of 375V.

X-FAB Silicon Foundries has announced the release of a reference design kit for Tanner analogue/mixed-signal (AMS) software from the EDA segment of Siemens Digital Industries Software. The new kit is based on silicon-proven circuitry, providing full coverage of the flow to design and simulate analogue and mixed-signal ICs.

X-FAB Silicon Foundries has introduced a new embedded Flash memory capability for its XP018 high-voltage automotive process. This new Flash IP leverages X-FAB’s already widely proven Silicon Oxide Nitride Oxide Silicon (SONOS) technology, which offers a combination of elevated levels of performance and best-in-class reliability.

X-FAB Silicon Foundries has made augmentations that extend the scope of its XS018 180nm sensor process. As a result, the company is now able to offer a photodiode-specific process core module. Whereas previously the XS018 process had been mainly focused on the fabrication of multi-pixel CMOS image sensors, this new module is dedicated to photodiode fabrication.

X-FAB Silicon Foundries and IHP have announced an industry-academic partnership. The objective of the cooperation between these two bodies, which brings together X-FAB’s proficiency in semiconductor manufacture with IHP’s wireless communication expertise, is to exchange knowledge and establish mutually beneficial engineering synergies.

X-FAB Silicon Foundries has just introduced its latest generation of avalanche photodiode (APD) and single-photon avalanche diode (SPAD) devices. Leveraging its proven automotive-qualified 180nm XH018 high-voltage process, X-FAB’s new APDs and SPADs benefit from innovative architectural modifications, with substantial improvements in performance exhibited compared with the company’s earlier devices (which were initially announced back...

X-FAB Silicon Foundries SE has announced that it is now able to offer a series of solutions that support the implementation of microfluidic structures directly on to CMOS dies. Through these, customers will be better able to address commercial opportunities arising that relate to lab-on-a-chip, DNA sequencing and synthesis, rare cell sorting, medical implants, pharmaceutical research, drug administering, food safety testing and many other applica...

X-FAB Silicon Foundries and with Attopsemi, have entered into a collaboration to satisfy the memory requirements of 5G technology. The companies have announced successful qualification of Attopsemi’s I-fuse OTP memory in relation to X-FAB’s XR013 open-platform foundry 130nm RF-SOI technology.

X-FAB Silicon Foundries SE has announced the appointment of Jörg Doblaski as its new Chief Technology Officer (CTO). He fills the role of former CTO Dr. Jens Kosch, who is becoming an X-FAB Fellow and will serve as an adviser to the company’s CEO Rudi De Winter.

In order to address heightening demands, X-FAB Silicon Foundries has taken steps to simplify the integration of microfluidic elements with CMOS and SOI dies. Part of its extensive MEMS-oriented technology offering, the company is now able to provide a large variety of process capabilities for silicon- based microfluidic systems.

X-FAB, along with technology partner EUROPRACTICE, have announced the winning project in their competition to encourage further MEMS-based innovation. The triumphant project, entitled ‘Capacitive MEMS Sensors for High-Resolution Interactive Vibrotactile Displays’, was submitted by a team of engineers from the University of Bath.

X-FAB Silicon Foundries SE continues to drive the adoption of silicon-carbide technology forward by offering SiC foundry services at the scale of silicon.

X-FAB Silicon Foundries SE, the leading analogue/mixed-signal and specialty foundry, has announced the availability of new medium-voltage transistors – complementing the company’s leading 180nm BCD-on-SOI technology platform (XT018). The new medium voltage devices cover voltages from 12 to 32V. With that customers now have access to a complete portfolio of different voltage options – covering a ten to 200V voltage range.

  X-FAB Silicon Foundries SE has announced that it is broadening the scope of its cooperation with the EUROPRACTICE Consortium which counts high profile institutions such as Fraunhofer Institute for Integrated Circuits and imec as members.

X-FAB Silicon Foundries has announced that its high-voltage 180nm CMOS semiconductor process (XH018) is now available for automotive applications via the company’s production facility in France. This is a major step in X-FAB’s plan to offer dual sourcing for all its 180nm processes (in both CMOS and SOI), so that continuity of supply is always assured.