Tensilica announced that HiSilicon Technologies, a division of Huawei, has expanded its license (announced February 9, 2010) for Tensilica's dataplane processors (DPUs), ConnX(TM) Baseband Engine (BBE16), and HiFi Audio DSP (digital signal processing) semiconductor IP cores for LTE (Long-Term Evolution) basestations, handsets and other network infrastructure and customer premise equipment.

SRS Labs, officially recognized as one of America's Greatest Brands and the industry leader in surround sound, audio and voice technologies, and Tensilica Inc., today announced that Tensilica is the first intellectual property (IP) core supplier to commercially support SRS StudioSound HD(TM), the latest and most advanced all-in-one audio solution available for flat panel televisions and home theater sound bar manufacturers. Availability of SRS St...

Tensilica today announced that the NatureDSP Math library from IntegrIT DSP Design House, a leading supplier of DSP and VoIP software solutions, is now available for Tensilica's HiFi Audio DSPs for system-on-chip (SOC) design. The IntegrIT NatureDSP Math library simplifies the software development process for design teams that want to port their own software codecs to the HiFi Audio DSP. The IntegrIT Nature DSP Signal+ is a collection of signal ...

Tensilica and 4M Wireless today announced that 4M Wireless has completed its port of the PS100 LTE protocol stack to Tensilica's ConnX(TM) Atlas LTE reference architecture and has also officially joined Tensilica's Xtensions(TM) partner network. 4M Wireless has also ported its PS100 LTE protocol stack to the LTE system platform from Blue Wonder Communications, another Tensilica partner.

Tensilica, Inc today announced that Fujitsu Limited?has made a strategic investment in Tensilica. Tensilica is a major semiconductor IP (intellectual property) supplier specializing in dataplane processor (DPU) cores, which are a combination of CPU (central processing unit) and DSP (digital signal processor) that can be rapidly customized to provide 10-100x the performance of standard CPUs and DSPs. Tensilica's DPUs are widely used in system-on-c...

Tensilica,® Inc. today announced that AppliedMicro (Nasdaq:AMCC) has selected Tensilica's Xtensa® LX dataplane processors (DPUs) for an upcoming high-throughput communications chip design project.

Tensilica, Inc. today announced that KPIT Cummins (BSE: 532400; NSE: KPIT), a leading product engineering and IT consulting partner to manufacturing companies, has joined Tensilica's Xtensions partner network and become an authorized design center. As a Tensilica Xtensions partner, KPIT Cummins will extend its capabilities to support customers on Xtensa core-based designs for a broad range of ASICs for infotainment and consumer electronics applic...

Tensilica Inc. today announced that Novatek Microelectronics Corp., of Hsinchu, Taiwan, selected Tensilica’s HiFi Audio DSP for upcoming DTV (digital television) and Blu-ray Disc SOC (system-on-chip) designs.

Tensilica, Inc. today announced that Chelsio Communications, Inc., of Sunnyvale, Calif., has licensed the Xtensa LX customizable DPU (dataplane processor) for its next-generation 10Gb Ethernet Terminator ASIC (application specific integrated circuit). Chelsio has used Tensilica's Xtensa DPUs in two previous generations of Terminator ASICs.

Tensilica Inc. and SySDSoft announced today their partnership to port SySDSoft’s LTE UE protocol stacks onto Tensilica’s ConnX™ Atlas LTE (long-term evolution) reference architecture for User Equipment (UE). SySDSoft has joined Tensilica’s Xtensions™ partner network. SySDSoft has also ported its LTE protocol stack to the LTE system platform from mimoOn, who also is a Tensilica partner.

Tensilica today announced that it has added the Free Lossless Audio Codec (FLAC) decoder to its ever-growing library of software for its HiFi Audio DSP family of IP (intellectual property) cores for SOC (system-on-chip) design. FLAC is an audio format similar to MP3, but lossless so the audio is compressed without any loss in quality. Because it is not a proprietary format, is not encumbered by patents, and has an open-source reference implement...

Tensilica Inc. today announced that it is the first IP (intellectual property) company with an audio core for system-on-chip (SOC) designs approved for using the Dolby® MS10 Multistream Decoder, a multi-format audio decoding technology, that supports Dolby Digital Plus and Dolby Pulse in a single package for next-generation HDTVs (high-definition televisions), STBs (set-top boxes) and DMPs (digital media players).

Tensilica today announced that it has expanded its baseband business unit and hired Eric F. Dewannain as vice president and general manager. Dewannain was previously general manager of the custom ASIC business unit at Texas Instruments, Incorporated (TI) and, prior to this, general manager of the cable broadband communications business unit. Dewannain has extensive business experience in mobile wireless infrastructure and broadband communication...

Tensilica, Inc. and Iberium Communications, Inc. today announced that they have established a partnership to develop solutions for digital television (DTV). Tensilica is the leading provider of dataplane processors (DPUs) for system-on-chip (SOC) designs. Iberium is a leader in semiconductor IP cores for DTV.

Tensilica, Inc. and Express Logic, Inc. today announced that Express Logic's ThreadX real-time operating system (RTOS) is now available for Tensilica's new third-generation Diamond Standard dataplane processor (DPU) cores. A free demo download of the ThreadX RTOS is available on the Tensilica web site at http://www.tensilica.com/partners/operating-systems/express-logic/threadx.htm. Designed for small-footprint, demanding real-time control, the Th...

Tensilica, Inc. today introduced its third generation ConnX 545CK 8-MAC (multiply-accumulate) VLIW (very long instruction word) DSP (digital signal processor) core for system-on-chip (SOC) designs. Improvements in this third generation dataplane processor (DPU) core deliver up to 20 percent faster clock speed, 11 percent smaller die and up to 30 percent lower power consumption.

Tensilica, Inc. today announced that its Japan office has moved to a larger, more easily accessible office building and is celebrating the move and its success in the Japan market with a customer seminar on May 24. Highlights of the seminar include presentations by NTT DOCOMO and Epson, as well as discussions of Tensilica's popular HiFi audio DSPs (digital signal processors) and ConnX Atlas LTE (long-term evolution) reference architecture.

Wolfson Microelectronics plc and Tensilica, Inc., today announced a licence agreement to create a low power, high definition (HD) sound platform. Combining Wolfson's world-leading mixed-signal technology and audio expertise with Tensilica's innovative HiFi audio digital signal processor (DSP) cores, this licence agreement will bring HD sound to multimedia platforms, including mobile handsets, netbooks, smartbooks, digital TVs and other multimedi...

Tensilica Inc. today introduced its third generation ConnX 545CK 8-MAC (multiply-accumulate) VLIW (very long instruction word) DSP (digital signal processor) core for system-on-chip (SOC) designs. Improvements in this third generation dataplane processor (DPU) core deliver up to 20 percent faster clock speed, 11 percent smaller die are and up to 30 percent lower power consumption.

Tensilica Inc. and Express Logic Inc. announced that Express Logic’s ThreadX® real-time operating system (RTOS) is now available for Tensilica’s new third-generation Diamond Standard dataplane processor (DPU) cores. A free demo download of the ThreadX RTOS is available on the Tensilica web site at http://www.tensilica.com/partners/operating-systems/express-logic/threadx.htm. Designed for small-footprint, demanding real-time control, the Thr...