Design
Invibio launches implantable PEEK filament for 3D printing
Invibio Biomaterial, part of Victrex, a pioneer in the development of PEEK biomaterial solutions, has announced the launch of PEEK-OPTIMA AM Filament, an implantable PEEK polymer that is optimised for additive manufacturing.
Integrated development kit speeds design of FPGA-based satellite systems
Developers using FPGAs to meet satellite system payload and throughput requirements can speed designs by prototyping with space-qualified devices rather than commercial off-the-shelf silicon.
Silanna Semiconductor expands multi-port fast charger reference design portfolio
Silanna Semiconductor has unveiled the latest addition to its family of AnyPort fully integrated reference designs that provide everything an engineer needs to prototype and test fully functional multi-port fast charger applications rapidly.
Bostik launches new Born2Bond engineering adhesives
Bostik’s Born2Bond HMPUR and UV-CIPG engineering adhesive ranges have been extended to serve the needs of automotive electronics designers and manufacturers looking to protect automotive components from heat, liquids, humidity, chemicals and vibrations.
Listen introduces a new portable dual-channel audio interface
AudioConnect 2, Listen’s new compact and high resolution two-channel audio interface is designed for measurements anywhere from the production line to out in the field and is particularly suitable for headphone testing and in-car measurements.
SEGGER J-Link and Flasher fully support Nations Technologies’ N32 series MCU
SEGGER announces that its J-Link debug probe, and its Flasher family of professional in-circuit programmers, now fully support the N32 series MCUs from Nations Technologies.
Partnership improves sustainability with cloud-based digital reality solutions
Hexagon’s Manufacturing Intelligence division and Altium have entered a strategic partnership which will help the design and manufacturing of electronics be more environmentally sustainable.
CELUS opens new platform for beta testing
CELUS, a provider of cloud-based, AI-supported electronics engineering software, has launched a beta platform for electronics enthusiasts, hobbyists and professionals to pursue their creative design projects.
Cincoze makes a strong debut at embedded world 2023
Rugged embedded computer brand, Cincoze, will make its grand debut at embedded world 2023 in Nuremberg, Germany on March 14-16, 2023.
Razorcat introduces new features: Hyper Coverage and Code Access in TESSY v5.1
At embedded world 2023, Razorcat is presenting a new version of their certified C/C++ unit and integration test tool TESSY including two innovative features: With “Code Access” and “Hyper Coverage” in TESSY v5.1, testers of embedded software can easily accumulate the coverage across different tests, testing levels and test tools – and automatically detect hidden or untested code in the full source code including all ...