As the world drives toward vehicle electrification, semiconductors enable automakers to optimize performance, accelerate development and make electric vehicles (EVs) more affordable for more people. Advancements in EV and powertrain design are driven by the need to reduce emissions, decrease weight and boost efficiency to help keep drivers on the road longer. 

Not too long ago, widespread adoption of electric vehicles (EVs) was nothing but science fiction. Once thought too expensive or impractical, we are now in the midst of an EV revolution driven by OEMs’ desire to achieve zero emissions and explore alternative energy sources.

Texas Instruments (TI) has launched a suite of application programming interfaces (APIs) giving customers a route to direct and convenient access to real time inventory of TI parts.

Texas Instruments (TI) will showcase technologies that are “Driving Electrification Forward” at electronica 2022 which runs Nov. 15-18 in Munich.

QMLV space-graded and radiation-tolerant products to help innovate your space designs

The TIDA-01027 reference design provides a foundation for corner radar applications to meet NCAP R79 safety requirements using the AWR2944 evaluation module (EVM). The design allows users to estimate and track the position (in the azimuthal plane) and velocity of objects in device field of view (FoV) up to 200 m.

Technology companies are looking to expand into more intelligent and advanced sensing in vehicle interiors. Consumers want to see applications such as child presence detection, occupant detection, vital-sign monitoring and gesture recognition. The in-cabin space currently has various camera-based and time-of-flight solutions; however, most of these are limited to only one application per device. Designers must then include multiple devices in the...

The AWR294x is a single chip mmWave Sensor composed of a FMCW transceiver, capable of operation in the 76-81 GHz band, radar data processing elements, and peripherals for in-vehicle networking. It is built with TI’s low power, 45 nm RFCMOS process and enables unprecedented levels of integration in a small form factor and minimal BOM. 

As FPGAs are continually upgrading their performance, so too is the need for their power consumption. As a result, designers are requiring systems with increased power density that have a level of reliability needed for the harsh environment in space. This webinar covered: The advantages of using TI’s radiation hardened and space enhanced plastic power components over up-screened commercial or automotive alternatives Designing with buck...

As aerospace technology continues to develop, the industry has seen a dramatic increase in the lifetime of satellites. With this increase, the operational lifetime of many satellites now surpasses that of the telecom standards they were developed around. Because of this, the need for re-programmability in space applications has also risen [1]. Microsemi® is one company that addresses this need with their SRAM based FPGA, the RTG4™.

As the demand for smart, automated and eco-friendly end-equipment continues to grow, industrial and automotive technologies are becoming increasingly electrified. With this trend also comes an increased emphasis on ensuring electronic systems not only meet standards of EV performance but safety standards as well. 

Today’s space industry is undergoing an unprecedented expansion across numerous dimensions. There is a rapid increase in the number of spacecraft deployed either in low-earth orbit, mid-earth orbit or geosynchronous orbit. An ever-expanding number of spacecraft includes advanced architectures that deliver a plethora of new scientific instruments.

The careful design of traction inverters for hybrid electric vehicles (HEVs) and electric vehicles (EVs) can help enable faster motor speeds, higher efficiency and a smaller system size while maintaining power density. New technologies allow automakers to create the vehicle of the future with longer range and optimum performance.

The UCC5870-Q1 device is an isolated, highly configurable single-channel gate driver targeted to drive high power SiC MOSFETs and IGBTs in EV/HEV applications. Power transistor protections, such as shunt-resistor–based overcurrent, NTC-based overtemperature, and DESAT detection, include selectable soft turn-off or two-level turn-off during these faults.

The DP83561-SP is a high reliability gigabit ethernet PHY designed for the high-radiation environment of space. The DP83561-SP is a low power, fully featured physical layer transceiver with integrated PMD sub-layers to support 10BASE-Te, 100BASE-TX and 1000BASE-T Ethernet protocols.

UCC14240-Q1 is a high isolation voltage DC/DC module designed to provide power to IGBT or SiC gate drivers. The high-accuracy output voltages provide better channel enhancement for higher system efficiency without over-stressing the power device gate.

The ADC12DJ3200QML-SP device is an RF-sampling, giga-sample, analog-to-digital converter (ADC) that can directly sample input frequencies from dc to above 10 GHz. In dual-channel mode, the ADC12DJ3200QML-SP can sample up to 3200 MSPS. In single-channel mode, the device can sample up to 6400 MSPS. 

Designers in the power electronics industry need new technologies and methods to increase system performance. C2000 real-time MCUs and GaN FETs join forces to meet efficiency and power-density challenges.

The DS90UB936-Q1 is a versatile deserializer capable of receiving serialized sensor data from source through an FPD-Link III interface. When paired with a DS90UB935-Q1 serializer, the DS90UB936-Q1 receives data from imagers supporting up to 2.528 Gbps CSI-2 throughput

The LP8774x-Q1 device is designed to meet the power management requirements of the AWR and IWR MMICs in various automotive and industrial radar applications. The device has three step-down DC/DC converters, a 5 V boost converter and a 1.8 V/3.3 V LDO. The LDO is powered from the boost and intended for xWR IO supply. The device is controlled by an SPI serial interface and by enable signals.