Nexperia

Address:
Jonkerbosplein 52
6534 AB Nijmegen
Netherlands

Phone: +31 24 353 9797

Web: http://www.nexperia.com


Nexperia articles

Displaying 1 - 9 of 9

Automotive LED drivers deliver 250mA output current

Automotive LED drivers deliver 250mA output current
Nexperia has extended its constant current LED driver family with eight new AEC-Q101 qualified devices to drive low- and medium-power LEDs up to 250mA. The 16V NCR32xx and 40V NCR42xx series are available in two package styles, the space-saving SOT457 (SC-74) and the SOT223 (SC-73), a slightly-larger option which delivers a higher power capability of up to 1,250mW.
1st April 2019

Automotive logic parts 64% smaller than leaded equivalents

Automotive logic parts 64% smaller than leaded equivalents
Specialist in discretes, logic and MOSFET devices, Nexperia, has announced that over twenty logic types in the company’s space-saving leadless MicroPak packages are now AEC-Q100 qualified. These logic solutions claim to be the smallest devices of their type suitable for automotive applications and Nexperia’s Q100 portfolio exceeds the Automotive Electronics Council’s requirements.
6th March 2019

Automotive MOSFETs for demanding powertrain applications

Automotive MOSFETs for demanding powertrain applications
Global specialist in discretes, logic and MOSFET devices, Nexperia, has introduced a portfolio of low RDS(on) 40V AEC-Q101 MOSFETs targeting space-constricted, increased-power modules in demanding powertrain applications. Housed in the miniature, LFPAK33 package which has a footprint of only 10.9mm² and a pitch of just 0.65 mm, devices use Nexperia’s Trench 9 technology.
14th February 2019


Lowest RDS(on) automotive MOSFETs down to 0.9mΩ

Lowest RDS(on) automotive MOSFETs down to 0.9mΩ
Nexperia has announced the release of the company’s lowest RDS(on) automotive-qualified MOSFETs. The AEC-Q101 Trench 9, 40V automotive superjunction MOSFETs in the rugged, electrically- and thermally-efficient LFPAK56E deliver a footprint reduction of up to 81% when compared to traditional solutions such as bare die modules, D2PAK or D2PAK-7 devices. The 0.9mΩ, 220ADC-rated BUK9J0R9-40H MOSFET suits applications up to 1.2kW, and is also lower cost than larger D2PAK.
7th June 2018

Broad range of space-saving PN and Trench Schottky rectifiers

Broad range of space-saving PN and Trench Schottky rectifiers
Nexperia has announced the launch of a wide range of PN and Trench Schottky rectifiers for power applications including automotive, industrial and consumer. In total, the company now offers more than 90 devices in the CFP packages. Nexperia CFP packaging is size- and thermally-efficient. The package design has a solid copper clip and exposed heat sink to reduce the package’s thermal resistance and optimise the transfer of heat into the ambient environment, allowing smaller and thinner PCB designs.
12th March 2018

Robust MOSFETs suitable for automotive applications

Robust MOSFETs suitable for automotive applications
  Former Standard Products division of NXP, Nexperia, has announced a new series of Trench 9 power MOSFETs, targeted primarily at the automotive industry, which combine the company’s low voltage superjunction technology with its advanced packaging capability to deliver high performance and ruggedness.
5th October 2017

Automotive power MOSFETs designed for space efficiency

Automotive power MOSFETs designed for space efficiency
The former standard products division of NXP, Nexperia has announced a new range of 80V dual Power-SO8 MOSFETs in the popular LFPAK56D package. With the addition of this new 80V range of MOSFETs, Nexperia now offers what it claims to be the industry’s most comprehensive portfolio of devices, ranging from 30-100V. LFPAK56D is fully automotive qualified to AEC-Q101 and has a proven track record for quality and reliability.
26th September 2017

Achieving automotive power in a smaller package

Achieving automotive power in a smaller package
At embedded world Nexperia, the former Standard Products division of NXP, announced the availability of its automotive power MOSFETs in the new, LFPAK33, thermally enhanced, loss-free package which has a footprint more than 80% smaller than industry standard devices. LFPAK33 devices also feature a lower resistance, responding to growing industry pressure to reduce the size of modules in the car while continuing to improve energy efficiency and reliability. LFPAK33 MOSFETs enable the power infrastructure that allows next-generation automotive subsystems such as radar and ADAS technology to operate reliably and efficiently.
27th March 2017

Automotive power MOSFET package is 80% smaller

Automotive power MOSFET package is 80% smaller
Nexperia has announced the availability of its automotive power MOSFETs in the LFPAK33, thermally-enhanced, loss-free package which has a footprint more than 80% smaller than industry standard devices. LFPAK33 devices also feature a significantly lower resistance responding to growing industry pressure to reduce the size of modules in the car while continuing to improve energy efficiency and reliability.
15th March 2017


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