Heraeus Electronics GmbH

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Heraeus Holding GmbH
Heraeusstraße 12-14
D-63450 Hanau
Germany

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New Die Top System with power cycling capacity introduced

New Die Top System with power cycling capacity introduced
A new system for chip-top contacting in power electronics modules will be presented by Heraeus Electronics at the PCIM Asia conference in Shanghai from 26th to 28th June, 2018. The Die Top System boosts the chip’s current carrying capacity by more than 50% and offers greater reliability, which allows manufacturers of electric and hybrid cars to test the limits of power transmission in simulation tests.
27th June 2018


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