Automotive Components

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Freescale accelerates automotive safety with advanced airbag sensors

The development of safer vehicles is a key technology driver for the automotive industry, with airbag safety systems leading the charge. The U.S. National Highway Traffic Safety Administration (NHTSA) estimates that frontal air bags alone saved more than 25,780 lives between 1987 and 2008. As automotive suppliers continue to incorporate critical safety features in their designs, they must continue improving performance, while at the same time reducing cost to gain a competitive edge.
24th January 2011

Freescale reveals new integrated technology for intelligent networking applications in automobiles

Freescale Semiconductor is introducing its next-generation technology to serve the fast-growing automotive intelligent distributed nodes market. Freescale’s new integrated LL18UHV technology, along with existing S12 microcontroller (MCU) system-in-package (SiP) product families, meet the technical and commercial demands of applications in which space requirements and cost need to be minimised, such as window-lifts, sunroofs and motor control.
24th January 2011

Freescale chips drive next-generation automotive body electronics applications

As drivers opt for more comfort and convenience features in their cars, automotive body electronics will continue to require more complex semiconductors while maintaining competitive price points. Freescale Semiconductor is expanding its popular line of 16-bit S12 microcontrollers (MCUs) optimised for a broad range of cost-sensitive automotive body electronics applications. The advanced S12G devices are designed to accommodate application requirements, with flexibility in memory, package and cost options.
24th January 2011


Fujitsu - Graphics Controller for Hybrid & Re-configurable Dashboards and Car Navigation

Fujitsu - Graphics Controller for Hybrid &  Re-configurable Dashboards and Car Navigation
Fujitsu Semiconductor Europe announces the development of MB86R11, a single chip enabling the development of next-generation automotive display systems of hybrid and re-configurable dashboards as well as car navigation and assistance systems.
24th January 2011

ST at ITS 2010: Silicon Solutions for Safer and Smarter Cars

A top-three automotive semiconductor vendor, STMicroelectronics will demonstrate its latest innovations for car safety, navigation and infotainment at the 17th ITS World Congress held in Busan, Korea, on October 26-29, 2010. ITS is the world’s largest exhibition and conference on intelligent transport systems and services. ST supplies chips to all major automotive manufacturers and its portfolio of automotive solutions covers all key application areas in the car. The Company combines an unparalleled platform of advanced technologies with a thorough understanding of the automotive market that it has gained through close collaboration with leading customers and an unswerving commitment to quality.
24th January 2011

NXP to develop cutting-edge automotive-qualified 3.5G telematics solution to improve traffic management in Singapore

NXP Semiconductors N.V. today announced that it is developing a cutting-edge automotive-qualified 3.5G telematics solution to improve traffic management, which can help address the challenge of traffic congestion in Singapore. Expected to be deployed in 2012, NXP will develop innovative technologies based on NXP’s next-generation Automotive Telematics On-board Platform (ATOP). Singapore will be a test bed for ATOP, leveraging the city’s world-class infrastructure to deliver real-time information via mobile broadband and help reduce traffic congestion.
24th January 2011

OmniVision and Xilinx Develop Automotive Reference Design for 360-degree Surround View Applications

OmniVision Technologies, Inc. today announced that its OV9715 automotive-grade megapixel sensor has been selected by Xilinx, Inc. for its four camera, 360-degree surround view automotive reference design. The Xilinx reference design highlights the advantages of megapixel resolution sensors over VGA-based systems for extreme wide-angle field of view applications, such as greatly improved image distortion correction and stitching. Designed to meet the stringent requirements of the automotive and sensing applications markets, the OV9715 also improves on obstacle and pedestrian detection by capturing more detailed scene information.
24th January 2011

MEMS Accelerometer from STMicroelectronics Monitors and Tracks Motion and Tilt around the Car

MEMS Accelerometer from STMicroelectronics Monitors and Tracks Motion and Tilt around the Car
STMicroelectronics has expanded its sensor portfolio with a new automotive-grade 3-axis low-g accelerometer. Combining low power consumption and small footprint with high precision and robust performance, ST’s new accelerometer targets a wide range of automotive applications, including vehicle tracking, event recording, abuse monitoring, and dead-reckoning for enhanced navigation capabilities.
24th January 2011

STMicroelectronics Announces Accelerometers for Automotive Airbags

STMicroelectronics Announces Accelerometers for Automotive Airbags
STMicroelectronics (NYSE: STM), a leader in automotive ICs and in MEMS (Micro-Electro-Mechanical Systems) sensors, has introduced a new family of high-g acceleration sensors for advanced airbag systems. These micro-machined devices detect the rapid deceleration of the vehicle during a crash and send instant information to the airbag control unit.
24th January 2011

Toshiba unveils 130nm BiCD for next-generation automotive-rugged integration

Toshiba unveils 130nm BiCD for next-generation automotive-rugged integration
Toshiba Electronics Europe has revealed details of its new BiCD process, which combines 130nm logic design rule with current-handling capability to permit unprecedented integration in devices such as sensorless BLDC motor drives. The process is able to guarantee full specification over a wide temperature range, as well as high ESD robustness, providing a platform for a variety of industrial and automotive IC projects.
24th January 2011


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