Automotive Components

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MOST Cooperation Welcomes New Member Companies

MOST Cooperation Welcomes New Member Companies
The MOST Cooperation (the organization through which the leading automotive multimedia network Media Oriented Systems Transport (MOST) is standardized) is welcoming Bang & Olufsen, Molex, Nippon Seiki, Toyoda Gosei and TTTech on board as new member companies. This inflow to the MOST community reflects the wide-ranging acceptance of MOST Technology, stated Harald Schoepp, member of the MOST Cooperation Steering Committee. We consider it proof of the excellent design and standardization work of the MOST Cooperation. These latest registrations also add a broad variety of MOST solutions reaching from component manufacturers via Tier1 suppliers up to professional audio solutions. Regional acceptance stretches from Europe to North America and Asia.
24th January 2011

New MOST Generation MOST150 to Be Integrated in Audi A3 Vehicles First

New MOST Generation MOST150 to Be Integrated in Audi A3 Vehicles First
The MOST Cooperation is proud to announce that its core partner members Audi and Daimler will be the first carmakers to integrate MOST150 into series production vehicles. Since the first implementation of MOST25 in an Audi car in 2002, MOST has become the established standard for the networking of premium infotainment systems at Audi, stated Jens Koetz, Director of the division of electrical/electronic design, networking, energy systems, and system safety at AUDI AG. Now the new generation MOST150 offers unique advantages as a speed upgrade through consistent further development of the existing transmission technology. Infotainment applications place very different demands on the network infrastructure, and MOST150 provides all the communication mechanisms over one interface, an all-in-one approach.
24th January 2011

Freescale accelerates automotive safety with advanced airbag sensors

The development of safer vehicles is a key technology driver for the automotive industry, with airbag safety systems leading the charge. The U.S. National Highway Traffic Safety Administration (NHTSA) estimates that frontal air bags alone saved more than 25,780 lives between 1987 and 2008. As automotive suppliers continue to incorporate critical safety features in their designs, they must continue improving performance, while at the same time reducing cost to gain a competitive edge.
24th January 2011


Freescale reveals new integrated technology for intelligent networking applications in automobiles

Freescale Semiconductor is introducing its next-generation technology to serve the fast-growing automotive intelligent distributed nodes market. Freescale’s new integrated LL18UHV technology, along with existing S12 microcontroller (MCU) system-in-package (SiP) product families, meet the technical and commercial demands of applications in which space requirements and cost need to be minimised, such as window-lifts, sunroofs and motor control.
24th January 2011

Freescale chips drive next-generation automotive body electronics applications

As drivers opt for more comfort and convenience features in their cars, automotive body electronics will continue to require more complex semiconductors while maintaining competitive price points. Freescale Semiconductor is expanding its popular line of 16-bit S12 microcontrollers (MCUs) optimised for a broad range of cost-sensitive automotive body electronics applications. The advanced S12G devices are designed to accommodate application requirements, with flexibility in memory, package and cost options.
24th January 2011

Fujitsu - Graphics Controller for Hybrid & Re-configurable Dashboards and Car Navigation

Fujitsu - Graphics Controller for Hybrid &  Re-configurable Dashboards and Car Navigation
Fujitsu Semiconductor Europe announces the development of MB86R11, a single chip enabling the development of next-generation automotive display systems of hybrid and re-configurable dashboards as well as car navigation and assistance systems.
24th January 2011

ST at ITS 2010: Silicon Solutions for Safer and Smarter Cars

A top-three automotive semiconductor vendor, STMicroelectronics will demonstrate its latest innovations for car safety, navigation and infotainment at the 17th ITS World Congress held in Busan, Korea, on October 26-29, 2010. ITS is the world’s largest exhibition and conference on intelligent transport systems and services. ST supplies chips to all major automotive manufacturers and its portfolio of automotive solutions covers all key application areas in the car. The Company combines an unparalleled platform of advanced technologies with a thorough understanding of the automotive market that it has gained through close collaboration with leading customers and an unswerving commitment to quality.
24th January 2011

NXP to develop cutting-edge automotive-qualified 3.5G telematics solution to improve traffic management in Singapore

NXP Semiconductors N.V. today announced that it is developing a cutting-edge automotive-qualified 3.5G telematics solution to improve traffic management, which can help address the challenge of traffic congestion in Singapore. Expected to be deployed in 2012, NXP will develop innovative technologies based on NXP’s next-generation Automotive Telematics On-board Platform (ATOP). Singapore will be a test bed for ATOP, leveraging the city’s world-class infrastructure to deliver real-time information via mobile broadband and help reduce traffic congestion.
24th January 2011

OmniVision and Xilinx Develop Automotive Reference Design for 360-degree Surround View Applications

OmniVision Technologies, Inc. today announced that its OV9715 automotive-grade megapixel sensor has been selected by Xilinx, Inc. for its four camera, 360-degree surround view automotive reference design. The Xilinx reference design highlights the advantages of megapixel resolution sensors over VGA-based systems for extreme wide-angle field of view applications, such as greatly improved image distortion correction and stitching. Designed to meet the stringent requirements of the automotive and sensing applications markets, the OV9715 also improves on obstacle and pedestrian detection by capturing more detailed scene information.
24th January 2011

MEMS Accelerometer from STMicroelectronics Monitors and Tracks Motion and Tilt around the Car

MEMS Accelerometer from STMicroelectronics Monitors and Tracks Motion and Tilt around the Car
STMicroelectronics has expanded its sensor portfolio with a new automotive-grade 3-axis low-g accelerometer. Combining low power consumption and small footprint with high precision and robust performance, ST’s new accelerometer targets a wide range of automotive applications, including vehicle tracking, event recording, abuse monitoring, and dead-reckoning for enhanced navigation capabilities.
24th January 2011


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