Enclosures and panel PCs for railway applications to be showcased

26th July 2016
Source: Polyrack
Posted By : Daisy Stapley-Bunten
Enclosures and panel PCs for railway applications to be showcased

At the InnoTrans Trade Fair (20th-23rd September, 2016 in Berlin) in Hall 2.1, Booth #413, POLYRACK TECH-GROUP will be presenting its many years of experience and achievements as a certified manufacturer related to enclosure solutions, panel PCs for HMI/MMI applications and examples of integrated implementations in the Electronic Packagings market.

The focus of the product presentations at the InnoTrans trade fair will be on representative product development examples with a wide range of different solution approaches and choice of materials in the field of transport and railway technology.image 1

One highlight at the trade fair is the extensive presentation of panel PCs for HMI/MMI applications which can be used in various areas associated with railway technology, including the POLYRACK Panel-PC 2. Developed for panel PC and/or display and operating systems, the enclosures are typically used in industrial environments. The display frames with an appealing design element has been prepared for a 12" display, but can also be adjusted to other sizes. Thanks to the two-part concept in sandwich construction, they can be assembled easily and flexibly.

The vibration-proof FerroRAIL 19" subrack series is particularly aimed for use in demanding applications in rail vehicles, or for French SNCF (Société Nationale des Chemins de fer Français) railway applications respectively. Thus, users in other harsh application areas can also be sure, that they will receive an all-round stable, reliable and, at the same time, pleasing adaption for their standardized 19“ subracks. FerroRAIL is based on the tested FUTURE subrack family.

In the version for railway technology with its shaking, bumping and vibration stresses, the subrack is installed in verified steps for the respective requirement for the product and its intended purpose.

The CasTEC case series was designed specifically for use in harsh industrial environments. The die-cast platform provides the required robustness with a higher IP protection and EMC shielding at the same time.

image 2

 The portfolio of POLYRACK TECH-GROUP includes integrated solutions for rack-mount and desktop cases, panel PCs, backplanes and Microcomputer Packaging Systems (MPS) as well as customised solutions especially for the typical requirements of railway applications. For the wide range and depth of products from a single source, the group has combined the expertise of the companies POLYRACK Electronic-Aufbausysteme GmbH, RAPP Kunststofftechnik GmbH and RAPP Oberflächenbearbeitung GmbH for 35 years.

The InnoTrans Trade Fair has established itself as an international platform for the industry, specialising in transport technology, i.e. innovative components, vehicles, systems.

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