Grade buck DC/DC converters designed for assisted driving

20th September 2018
Posted By : Lanna Cooper
Grade buck DC/DC converters designed for assisted driving

ROHM has recently announced the availability of the BD9S series (BD9S400MUF-C, BD9S300MUF-C, BD9S200MUF-C, BD9S100NUX-C, BD9S000NUX-C). This series of automotive synchronous secondary buck DC/DC converters have a high reliability and low power consumption in a compact form factor with a temperature range of -40 to +125°C. The products are offered in a leadless package with wettable flanks.

This makes them very suitable for using them in applications like radars, cameras and sensors which can be used for assisted driving.

The growing demand for safety requires the adoption of accident prevention systems and the evolution of self-driving cars. This in turn requires a higher number of subsystems including sensors and camera modules, resulting in higher power consumption. At the same time, it is necessary to decrease the component size and quantities to reduce vehicle weight.

In response to the challenging power supply IC requirements, ROHM delivers performance leveraging design and manufacturing technologies cultivated over many years along with a fully integrated production system. The power supply ICs also contribute to improved safety, which is required in future applications.

The BD9S series is comprised of a very compact, highly efficiency automotive-grade power supply ICs that include an enable function to adjust the startup time and a PGOOD output indication to improve system functional safety.

This broad lineup of products supports output currents from 0.6-4.0A. It is offered in the 2 and 3mm2 space-saving packages that deliver high efficient operation, resulting in a power conversion efficiency of 90% (at 3.6V input/1.8V output).

Additionally, the current mode control ensures fast response to load transients and combined with a fixed 2.2MHz switching frequency, it prevents interference in the AM Band. This higher frequency allows use of smaller external components, which contributes to a higher degree of miniaturisation and power savings.

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