Supporting hi-res multimedia connectivity and camera devices with ethernet AVB standard, Toshiba has introduced the TC358791XBG automotive companion chip. The AEC-Q100 Grade 3 qualified chip, features differential CVBS interfaces for analogue composite video sources, support for early back-up camera view (CVBS to LVDS) and the ability to relay packetised IQ audio tuner data to the host via USB.
Reducing time-to-market and overall system BOM costs, Toshiba's TC358791XBG suits applications such as front/rear/surround-view cameras, digital audio and transferring hi-res video content to head-unit and rear-seat entertainment systems.
As a result of versatile connectivity options for both audio and video, including USB 3.0, MIPI CSI2 and DSI, the chip seamlessly supports and interfaces with many cutting-edge automotive application processors on the market. The TC358791XBG provides the capability to split one video input into two pictures and simultaneously drive two hi-res LVDS digital displays. Hi-res audio and video data can also be sent from the host processor to multiple displays or other ECUs in the car, and an HDMI 1.4 receiver interface allows smartphones and other HDMI-enabled devices to be connected to the application processor.
Supplied in a 15x15mm FBGA257 package with 0.8mm ball pitch, samples of the TC358791XBG automotive infotainment chipset are available now.