A new system for chip-top contacting in power electronics modules will be presented by Heraeus Electronics at the PCIM Asia conference in Shanghai from 26th to 28th June, 2018. The Die Top System boosts the chip’s current carrying capacity by more than 50% and offers greater reliability, which allows manufacturers of electric and hybrid cars to test the limits of power transmission in simulation tests.
China is forging forward in the quest for further development of electromobility. A significant driver in the Chinese market is the quota system for electric vehicles established by the Chinese government, stating that automobile manufacturers are now required to produce a fixed quota of E-cars and plug-in hybrids. Starting in 2019, both domestic and foreign car-makers who fail to meet minimum targets for the proportion of alternative drives manufactured and sold will face sanctions.
In light of this requirement, the topic of power electronics is becoming increasingly important for automobile manufacturers.
Heraeus Electronics is presenting the Die Top System at the PCIM Asia conference in Shanghai. Developed from Danfoss Bond Buffer technology, the system offers new assembly and joining technology for silicon (Si) or wide-bandgap semiconductors.
Dr. Klemens Brunner, head of the Heraeus Electronics Global Business Unit, explained: “The Die Top System developed with Danfoss is particularly well suited for applications that demand high reliability.” To enable the reliability of the Die Top System to be tested upfront, Heraeus Electronics is the only company in China to offer a new engineering service, the Power Cycling Test, from now onwards. This means that customers can see on site if the Die Top System meets their specific needs. “Manufacturers of electric and hybrid vehicles can benefit from these advantages, which allow them to test the reliability of the Die Top System for their purposes and to explore the limits of power transmission in a power cycling test on site in China.”
With its new design, the Die Top System aims to increase the power module’s current carrying capability, as well as boost its power cycling capability. This makes it possible to have junction temperatures of up to 200⁰C. A conductive copper foil is applied to the semiconductor chip using a sinter paste, which distributes the current evenly across the semiconductor chip, reducing heat and better avoiding hot spots in the semiconductor. The foil also strengthens the chip during production for the power module. As a result, more efficient copper bonding wires can be used in place of traditional aluminium bonding wires. This makes it possible to achieve more power with the same module size or equivalent power with smaller modules.
Heraeus Electronics can be found in hall two, booth c05 at PCIM Asia, 26th to 28th June 2018.