COMVEC panel on AI in commercial vehicles announced

15th August 2018
Source: AVX
Posted By : Alex Lynn
COMVEC panel on AI in commercial vehicles announced

Manufacturer and supplier of advanced electronic components and interconnect, sensor, control, and antenna solutions, AVX Corporation, has been invited to participate in a technical panel discussion about artificial intelligence and machine learning for commercial vehicles at the COMVEC 2018 conference and exposition.

The event will take place 11th to 13th September in Rosemont, Illinois, and will focus on disruptive technologies in the global commercial vehicle market. Hosted by SAE International, COMVEC is widely recognised as the leading annual technical event for the on and off highway industry, and is attended by design engineers, supply managers, executives, technologists, researchers, academics, consultants, and government representatives working in the agricultural, construction, industrial, military, and mining sectors.

This year’s event will feature two vertical symposia tracks, nearly 20 expert panel discussions, and dynamic technical displays all designed to provide practical knowledge about the latest tools, challenges, solutions, and opportunities in the industry, encourage lively discussion amongst presenters and attendees, facilitate networking, and spark innovation. 

AVX Fellow Ron Demcko and Caterpillar Chief Analytics Director, Morgan Vawter, will participate in the Total Vehicle Mechatronics and Integration Committee panel discussion, ‘Artificial Intelligence and Machine Learning’, which will take place Tuesday, 11th September, from 10:30am to 12:00pm, and will focus on the important role that artificial intelligence (AI) will play in shifting the current landscape of the transportation industry.

The panellists will address various vehicular applications of AI and will answer questions about topics including AI technologies currently applied in transportation applications, the AI integration process, current examples of AI in the transportation industry, a technological roadmap for vehicular AI, and strategies that suppliers are enacting to develop safe, viable, and robust vehicular AI systems. 

The AVX portion of the panel will focus on the benefits that innovative, automotive-grade, high reliability, and high value passive components, and especially those imbued with self-healing capabilities, can provide in the critical path, processing, safety, and propulsion circuitry of advanced driver assistance systems (ADAS) and commercial and military vehicle AI systems. 

AVX Fellow, Ron Demcko, stated: “The eventual introduction of AI will provide massive safety and efficiency improvements across the commercial vehicle market and, although ICs will undoubtedly control these AI systems — whether in series of multiples that vote to confirm actions and control the system or via internal error-detection and self-correction mechanisms — all ICs need power I/O and sense lines; so, advanced passive components will be a critical enabling element of these cutting-edge systems.

“It can be very difficult to make critical elements like power I/O and sense lines triple-redundant, but AVX has developed a number of innovative, automotive-grade components that can provide the high-reliability passive performance that these systems depend on to deliver the proven-safe performance commercial vehicles demand.” 

For example, several high reliability, solid electrolytic tantalum polymer and multilayer organic (MLO) capacitors are ideally suited for use in critical camera and LIDAR applications and in vehicle-to-vehicle (V2V) and vehicle-to-everything (V2X) diplexers on critical RF links. Additionally, low-inductance ceramic capacitors (LICCs) are well suited for use around the processing core, FLEXISAFE MLCCs for critical data lines, niobium oxide OxiCap NOS Series capacitors for high priority safety circuits, Accu-P Series microwave/RF capacitors for ultra-narrow band filters, W2H Series high-current feed-through capacitors for ultra-broadband filters, and SCM Series supercapacitors for module hold-up applications.

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