ATP showcases automotive solutions at Embedded Technology 2015

11th November 2015
Posted By : Nat Bowers
ATP showcases automotive solutions at Embedded Technology 2015

At Embedded Technology 2015, 18th to 20th November in Yokohama, Japan, ATP will showcase its storage solutions from its booth located at #F-24-08. Highlights will include new high density aMLC/MLC SD3.0 UHS-I SD/microSD, CF/CFast, 2.5” SSD and other embedded flash modules, which are suitable for automotive applications.

Automotive applications (IVI, drive recorder, 2D/3D navigation, etc.,) usually require more than performance and durability but also demand reliable memory storage for inconsistent power supply/rough operating situations and frequent data programing/reading. ATP Flash storage is based on strict validation processes, including: its in-house NAND Flash IC level test, which ensures NAND IC functions won’t be compromised due to NAND Flash lithographies shrink; usage model test/specific industry standard test; and additional power cycling tests integrating hardware/firmware techniques to offer an advanced level of protection and ensure NAND Flash data integrity.

ATP's automotive IVI testing and SiP technology enable high reliability together with extreme tolerance to temperature, vibration, dust and humidity in harsh operating conditions.

ATP also implements its distinct mass production level reliability demonstration test which uses intelligent production level tests based on NAND characteristics (rather than pure brute force copy/compare) to increase test efficiency, support wide temperature ranges, fully test NAND Flash blocks (FW/user/spare area) and execute rating monitoring systems via screening mechanisms to ensure ATP product quality and reliability before shipping to customers.

ATP will reveal its automotive storage memory solutions and 'Power Cycling Test Demonstration Kit' in booth #F-24-08.

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