Events News

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Lightweight materials catch the eye at automotive show

Lightweight materials catch the eye at automotive show
A Mini One insulated with individually designed 3D and 2D NVH parts which utilise a range of technologies, including thermoforming, drape moulding, cut and seal, die cutting and reaction moulding was the centrepiece of Automotive Insulations stand at the International Supplier Fair in Germany.
31st October 2014

Automotive connectivity chips on parade in Detroit

Broadcom has been demonstrating its strengths at the 2014 SAE Convergence Conference & Exhibition by showcasing its full line of automotive connectivity technologies, including the BroadR-Reach Automotive Ethernet portfolio and wireless combo chips. Industry analysts predict 100 percent of new cars to be Internet-enabled by 2025, an industry revolution that will redefine the driving experience
21st October 2014

FPGAs enhance functionality for automotive systems designs

At SAE Convergence 2014, 21st to 22nd October in Detroit, USA, Altera is demonstrating FPGA solutions which allow designers to rapidly add features and functionality to their automotive systems. Product highlights at the show will include solutions for ADAS and infotainment applications based on Cyclone FPGAs.
21st October 2014


Samsung Invests Big to Maintain Leadership

Samsung Invests Big to Maintain Leadership
Samsung recently announced plans to build a new, cutting-edge wafer fab—a $14.7 billion investment for the company that will be located in Pyeongtaek, a city south of Seoul.  The new fab, slated to begin production in 2H17, will add to Samsung’s current impressive compilation of wafer fabs (Figure 1) as it seeks to maintain its leading position in memory IC sales and expand its system leadership beyond smartphones, Smart TVs, and tablets.  Investing large is not new to Samsung—it has allocated at least $10 billion per year on semiconductor capital expenditures since 2010 (Figure 2), and has accounted for 17-21% of total industry capital expenditures each year since then.
16th October 2014

'Secure Connections for a Smarter World'

NXP will present its high performance mixed signal solutions to enable 'Secure Connections for a Smarter World'. Key demonstrations at the show will include Cabrio Car, an automotive showcase of future of the connected car including use cases such as RFID number plates and e-driver licenses.
16th October 2014

See TI's industrial & automotive designs innovations

See TI's industrial & automotive designs innovations
Texas Instruments will be exhibiting analogue and embedded processing semiconductors which enable innovative technologies for industrial and automotive designs. Visitors can participate in hands-on demonstrations showing how the right products and solutions can make development quick and easy, even for complex systems.
15th October 2014

15th MOST ICA presents Mercedes-Benz C-Class designs

15th MOST ICA presents Mercedes-Benz C-Class designs
Car manufacturers, suppliers and academics are invited to the 15th MOST Interconnectivity Conference Asia (ICA), which takes place on 13th November, 2014 in Seoul, South Korea. Following an overview of the conference, members of the Steering Committee will present the latest MOST150 designs and applications for the Mercedes-Benz C-Class. In particular, testing, simulation, data logging, and diverse multimedia applications will be discussed.
15th October 2014

3rd Annual China Electric Vehicle Infrastructure Summit

Held from 26th to 27th March 2015 in Shanghai, the '3rd Annual China Electric Vehicle Infrastructure Summit' is now open for registration and sponsorship with early bird prices available.
14th October 2014

Car insulation technologies on show at Wolfsburg event

Car insulation technologies on show at Wolfsburg event
Automotive Insulations will make its debut at IZB, the International Suppliers Fair in Wolfsburg, the home of Volkswagen (Oct 14-16). The biennial event is one of Europe’s leading trade fairs for the automotive sector.   The company will exhibit a vehicle insulated with individually designed rapid prototyped 3D and 2D NVH parts which utilise a range of technologies including thermoforming, drape moulding, cut and seal, die cutting and reaction moulding. 
13th October 2014

Daimler chief to deliver keynote at CES 2015

Vehicle technology and its ramifications for society, mobility and the environment will be to the topic of a keynote address by Dr. Dieter Zetsche, chairman of the board of management of Daimler AG and Head of Mercedes-Benz Cars at the Consumer Electronics Shoew in Las Vegas (Jan 6-9,2015).
10th October 2014


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