Events News

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Experts debate technical, commercial & regulatory challenges

The Cambridge Wireless Automotive and Transport conference, in association with MEPC and Rhode & Schwarz, will bring together some of the most influential minds in the automotive and wireless industries to explore the future of autonomous vehicles. The speakers will highlight the complex technical, commercial and regulatory challenges involved in mainstreaming autonomous vehicle technology.
20th November 2014

Automotive technologies showcased in adapted Mini One

Automotive technologies showcased in adapted Mini One
Lightweight technology is being showcased at the Society of Motor Manufacturers and Traders (SMMT) exhibition this November. The exhibition is being staged to celebrate the organisation’s Award for Automotive Innovation 2014, the results of which will be announced at the annual dinner on Tuesday 25th November. The showcase event, which runs from 24th to 28th November, is being held at the SMMT’s Westminster showroom.
20th November 2014

Panasonic Presents Latest Smart Home and Automotive Applications at Electronica 14

Panasonic Automotive & Industrial Systems Europe (PAISEU) which combines the decades of experience from Panasonic Automotive Systems Europe, Sanyo Components Europe, Panasonic Industrial Devices Sales Europe and Panasonic Electric Works, will exhibit for the first time, as a newly founded consolidated company at Electronica 2014 – Munich, Germany, November 11-14.
13th November 2014


Fairchild to exhibit solutions for a smarter, cleaner world

Fairchild’s theme at this year’s electronica is ‘Move It. Sense It. Drive It.’. The company will be in A4.506 at the trade show, which takes place from 11th to 14th November 2014 in Munich. At the stand, Fairchild will provide attendees with information about it’s motor control, motion sensor and automotive solutions for a cleaner, smarter world.
6th November 2014

KEMET debut automotive capacitors at electronica

At B6.442 of electronica, KEMET will be both launching and showcasing capacitor families. The trade show takes place from 11th to 14th November 2014 in Munich.
5th November 2014

Advanced Engineering 2014 explores automotive electronics

Advanced Engineering 2014 explores automotive electronics
Following research which found that up to 50% of a vehicle’s value is held within the electronic functionality it offers, organisers of Advanced Engineering 2014 decided to focus on the automotive electronics supply chain at the Automotive Engineering show. Those who attend the Advanced Engineering event, which takes place from 11th to 12th November at the NEC, Birmingham, will have access to the two-day ‘Auto Electronics’ exhibitor showcase.
3rd November 2014

Lightweight materials catch the eye at automotive show

Lightweight materials catch the eye at automotive show
A Mini One insulated with individually designed 3D and 2D NVH parts which utilise a range of technologies, including thermoforming, drape moulding, cut and seal, die cutting and reaction moulding was the centrepiece of Automotive Insulations stand at the International Supplier Fair in Germany.
31st October 2014

Automotive connectivity chips on parade in Detroit

Broadcom has been demonstrating its strengths at the 2014 SAE Convergence Conference & Exhibition by showcasing its full line of automotive connectivity technologies, including the BroadR-Reach Automotive Ethernet portfolio and wireless combo chips. Industry analysts predict 100 percent of new cars to be Internet-enabled by 2025, an industry revolution that will redefine the driving experience
21st October 2014

FPGAs enhance functionality for automotive systems designs

At SAE Convergence 2014, 21st to 22nd October in Detroit, USA, Altera is demonstrating FPGA solutions which allow designers to rapidly add features and functionality to their automotive systems. Product highlights at the show will include solutions for ADAS and infotainment applications based on Cyclone FPGAs.
21st October 2014

Samsung Invests Big to Maintain Leadership

Samsung Invests Big to Maintain Leadership
Samsung recently announced plans to build a new, cutting-edge wafer fab—a $14.7 billion investment for the company that will be located in Pyeongtaek, a city south of Seoul.  The new fab, slated to begin production in 2H17, will add to Samsung’s current impressive compilation of wafer fabs (Figure 1) as it seeks to maintain its leading position in memory IC sales and expand its system leadership beyond smartphones, Smart TVs, and tablets.  Investing large is not new to Samsung—it has allocated at least $10 billion per year on semiconductor capital expenditures since 2010 (Figure 2), and has accounted for 17-21% of total industry capital expenditures each year since then.
16th October 2014


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