The next evolution of DLP technology for in-vehicle Head-Up Display (HUD) systems has been announced by Texas Instruments. The new DLP3030-Q1 chipset, along with supporting Evaluation Modules (EVMs), gives automakers and Tier-1 suppliers the ability to bring bright, dynamic Augmented Reality (AR) displays to windshields and place critical information within the driver's line of sight.
Designers can take advantage of the automotive-qualified DLP3030-Q1 chipset to develop AR HUD systems that project Virtual Image Distances (VIDs) of 7.5m and greater.
This is made possible by the architecture of DLP technology that enables HUD systems to withstand the intense solar loads created when projecting long VIDs.
The combination of increased VIDs and ability to showcase imagery across a wide Field Of View (FOV) gives designers the flexibility to create AR HUD systems with enhanced picture depth for an interactive, not distractive infotainment and cluster system.
Key features and benefits of the DLP3030-Q1 chipset:
Tools and support
Automakers and Tier-1 suppliers can easily evaluate, design and productise HUD systems regardless of where they are in the design cycle with one of three new EVMs featuring the DLP3030-Q1 chipset.