Design
Indium receives innovation award for halogen-free, cleanable solder paste
Indium has earned Electronics Manufacturing (EM) World's Innovation Award for SiPaste C201HF, a halogen-free, cleanable solder paste specifically formulated to accommodate fine feature printing processes, as seen with 01005 and 008004 components.
StratEdge high-temperature packaging technology
StratEdge is set to showcase its latest packaging technology for high-temperature applications at several industry conferences in April and May.
Hi-Lo Systems supports Infineon’s OPTIGA TPM firmware
Infineon and Hi-Lo Systems have announced their partnership in the area of Trusted Platform Module (TPM) security chips.
25 years of MISRA C: making safety & security relevant for embedded developers
When software applications work well, most of them are invisible to the user. When they fail, they can be annoying. Jay Thomas, Senior Director of Field Engineering, LDRA further explores.
Ford brings hands-free driving technology to UK roads
Ford has introduced a Level 2 hands-free advanced driver assistance system with regulatory approval for use on the motorway network in Great Britain – the first system of its kind approved in Europe.
MVTec further expands HALCON functionality with new deep learning features
MVTec Software will launch version 23.05 of the standard machine vision software HALCON on May 23, 2023.
New Dual Status Profiled Backlights combine two colours in a single device
New from OMC, Dual Status Profiled Backlights combine two colours of emitter in a single profiled backlight, enabling designers to use the single backlight source to indicate status very clearly, rather than a single colour backlight that is simply on or off.
SEGGER announces J-Link support for the TDK-Micronas HVC 5x SOC series
SEGGER’s debug probe J-Link now fully supports the new programmable SOC (system-on-chip) series by TDK-Micronas.
RTI introduces Connext Observability Framework
Real-Time Innovations (RTI) has announced the latest addition to its Connext Product Suite featuring the Connext Observability Framework.
Precision timing solution for low power FPGAs
SiTime, the precision timing company, has announced that it will provide its precision timing solutions to Lattice Semiconductor, the low power programmable specialist.