Design
Design Challenge launched to improve Little Free Libraries
element14 and Hackster, two Avnet communities, announced the launch of the ‘Little Free STEM Library Design Challenge,’ encouraging their communities of makers, designers, and engineers to host, build or upgrade a local Little Free Library with the STEM experience.
Innovative nuclear site monitoring and inspection technologies
On 14 June 2023, the Defence and Security Accelerator (DASA) and the Nuclear Decommissioning Authority (NDA) held the Remote Monitoring of Sensitive Sites demonstration event at the Harwell Satellite Applications Catapult.
Keysight enhances PathWave EDA software suite
Keysight Technologies has unveiled its PathWave Advanced Design System (ADS) 2024 electronic design automation (EDA) software suite.
CEA-Leti & Intel to develop atomically thin 2D TMDs
CEA-Leti and Intel have announced a joint research project to develop layer transfer technology of two-dimensional transition-metal dichalcogenides (2D TMDs) on 300mm wafers with the goal to extend Moore’s Law beyond 2030.
Quantum-resilient cybersecurity memory module
Blueshift Memory, designer of a novel proprietary high-speed memory architecture, has signed an agreement with Crypta Labs, developer of a quantum random number generator (QRNG) for resilient encryption, to create a cybersecurity memory solution that will be capable of countering threats from quantum computing.
Biotech company accelerates cheaper drug and vaccine manufacture
An Innovate UK-backed biotech company has achieved a biocomputer breakthrough which is accelerating the development and manufacture of cheaper drugs and vaccines.
World first: engineers create hyper-deformable lunar wheel
On Monday 19 June 2023, Venturi Group presented its latest invention at the international Paris Air Show in Le Bourget, France: a hyper-deformable lunar wheel.
Breakthrough UV curable adhesive for plastic sealing
Hernon Manufacturing is proud to unveil Hernon Ultrabond Sealant 721, a cutting-edge UV curable adhesive designed to deliver exceptional sealing capabilities for a wide range of plastics.
Teledyne FLIR introduces point-and-shoot thermography inspection
Teledyne FLIR, part of Teledyne Technologies Incorporated, has announced the FLIR E8 Pro, providing a larger 3.5” touchscreen with FLIR Ignite Cloud connectivity within the same pistol-grip form factor as legacy E8 series thermal cameras.
Pasternack ruggedised electromechanical relay switches
Pasternack, an Infinite Electronics brand and a provider of RF, microwave, and millimetre-wave products, has announced the release of its series of ruggedised electromechanical relay switches.