Design
RS unveils new circuit simulation tool for DesignSpark users
RS has announced the launch of a new circuit simulator tool for use by the 1.3 million members of the DesignSpark engineering community.
STMicroelectronics and Würth Elektronik cooperate for a high-performance power tool
Würth Elektronik and STMicroelectronics jointly developed a demo using a Würth power tool. The design, which efficiently drives a low-voltage brushless DC motor, is ideal for handheld power-tool applications.
How do you develop a HMI PCAP touch panel?
HMI input systems for machines, plants, and devices are technically complex and sophisticated.
Brand new in the portfolio: nPM1300 Power Management IC
Effective immediately, the new nPM1300 Power Management IC (PMIC) from Nordic Semiconductor expands Rutronik's portfolio.
New thermal conductive gap filler pad from Parker
The Chomerics Division of Parker has announced its new THERM-A-GAP PAD 80 high-performance gap filler pad is now available.
Diisocyanate in polyurethane adhesives
New legislation requiring training for the handling of materials containing diisocyanates, which is coming in on 24 August 2023, has brought attention to polyurethane adhesives (PUs).
3D hologram research could lead to improved IVF success
In a world first, 3D holographic images of an embryo have been developed as part of a collaborative research project between the University of St Andrews and University of Adelaide.
Semiconductors of the future using cutting edge transistors
The significance of transistors capable of altering their properties cannot be understated in the advancement of future semiconductors.
Smart graphene paper allows for rapid testing
Chih-Jen Shih and Andrew deMello, chemical engineers from ETH Zurich, have spearheaded a project to create a fast-testing system using advanced graphene paper.
DELO introduces structural adhesive for electric motors
DELO has developed its first dual-curing, high-temperature adhesive for electric motor applications.