Design

Displaying 1 - 10 of 438

The ST33 - a trusted platform for automotive applications

The ST33GxxxA is a serial access microcontroller designed for secure mobile applications that incorporates the most recent generation of ARM processors for embedded secure systems.
20th April 2018

High speed boards designed for automotive development

High speed boards designed for automotive development
Provider of logicBRICKS Intellectual Property (IP) cores, design services and solutions for Xilinx, Xylon has launched three new FMC expansion boards that support the Texas Instruments FPD-Link III and Maxim Integrated Products next-gen GMSL automotive high speed serial links for in-vehicle video, audio, and communication data streams transfers.
20th April 2018

Automotive software provides the building blocks for development

Automotive software provides the building blocks for development
  The automotive division of Luxoft Holding has launched a base development platform called PELUX 1.0. It has been designed to provide the building blocks for automotive software development projects, which is now available on Open Source.
11th April 2018


High current SEPIC reference design for automotive lighting

In this video from Texas Instruments, watch a live demonstration of the high current SEPIC reference design for automotive lighting and ADAS applications, the PMP15027.
10th April 2018

MCU steps up power performance in automotive applications

MCU steps up power performance in automotive applications
A radar microcontroller from NXP Semiconductors has been engineered to meet the high-performance computation demands required by modern beam-forming and fast chirp-modulation radar systems. The S32R274 which is available from Mouser Electronics combines signal-processing acceleration with a multicore architecture to provide up to four times the power performance in industrial and automotive applications, compared to previous generations of products.
28th March 2018

Flash memory microcontroller features embedded flash technology

Flash memory microcontroller features embedded flash technology
The sample shipment of the flash memory microcontroller using a 28nm process technology has been announced by Renesas Electronics. To contribute to the realisation of next-gen green cars and autonomous vehicles with higher efficiency and higher reliability, the RH850/E2x Series MCU incorporates up to six 400MHz CPU cores, which according to the company makes it the first on-chip flash memory automotive MCU to achieve the industry's highest processing performance of 9600 MIPS.
27th March 2018

Trace timing analysis accelerates in the automotive sector

Trace timing analysis accelerates in the automotive sector
  Luxoft Holding has launched LuxTrace, a new and improved web-based version of TraceAnalyzer 4.0, a timing analysis tool for visualising system timing in terms of the constituent ECUs, controllers, processors, buses and networks, which processes large traces up to ten times faster than the previous version.
27th March 2018

MEMs oscillators improve performance in harsh environments

MEMs oscillators improve performance in harsh environments
  Microchip has announced technological advancements and the increased adoption of complex electronics systems in modern vehicles requires superior timing performance and reliability. Timing precision, accuracy and tolerance to harsh environments are essential to ensuring precise operation in today’s highly-advanced automotive systems.
26th March 2018

EnSilica extends its automotive design and supply services

EnSilica extends its automotive design and supply services
  EnSilica has announced that it is extending its full service of chip design through to volume supply to meet the increasing requirements from the automotive market. To support this, the company has signed a Representative Agreement with Lojixx Technologies, who have many years of experience in the automotive market with market knowledge.
26th March 2018

Smart plastic interior

Smart plastic interior
Functional plastics make it possible: smart, comfortable and ultra-light interior concepts for the vehicles of the future. Insights were given by plastics and automotive experts at the "PIAE 2018" (Plastics In Automotive Engineering) in Mannheim on 14th to 15th March. The PIAE 2018, the world's largest congress for plastics experts in the automotive industry, ended successfully on Wednesday. Decision-makers from all over the world used the PIAE again to inform, network and discuss.
21st March 2018


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SPIE Photonics Europe 2018
22nd April 2018
France Strasbourg
MultiMedia Market 2018
23rd April 2018
France Paris
Hannover Messe 2018
23rd April 2018
Germany Hanover
Med-Tech Innovation Expo 2018
25th April 2018
United Kingdom Ricoh Arena, Coventry
The Future of Industrial IoT
26th April 2018
Germany Munich