Communications

RF transceiver targets Car-to-X applications

21st August 2014
Nat Bowers
0

The second product from the company's RoadLINK range, NXP Semiconductors introduces the TEF510x dual radio multi band RF transceiver. Designed specifically for Car-to-X (C2X) applications, the transceiver provides OEMs with an optimised solution to meet 802.11p modem functionality with the flexibility to support global deployments and various system configurations.

The RF transceiver meets Japanese 760MHz C2X requirements and US & European 5.9GHz C2X requirements, as well as 5.8GHz WiFi and DSRC specifications. The chip provides fast, accurate and reliable communication to and from the vehicle, bringing safety-critical information to the driver significantly faster than current, conventional applications can (according to NXP).

Thomas Hinz, Senior Product Marketing Manager, RoadLINK, NXP Semiconductors, comments: “As the industry-leader in C2X communication, our chips enable OEMs to utilise a unique software-defined radio approach, to deploy global solutions based on a single hardware platform with end-of-line configurability. We are launching the best performing C2X solutions in the market. It’s the only solution that has been field proven in simTD and Safety Pilot, and which easily exceeds all of emerging Car-to-Car minimum performance requirements. It’s fast, it works over extended distances and it has the features to fully realise the potential of C2X technology. NXP is dedicated to developing leading performance solutions to connect the car securely, improving road safety, reducing traffic congestion, ultimately creating smarter transport infrastructure.”

ALPS Electric is already using products from NXP’s RoadLINK range to deliver in-car applications. Yoshitada Amagishi, Director and General Manager, Engineering HQ, ALPS, stated: “ALPS Electric is committed to delivering enhanced connected car technology to its customers. We have chosen to work with NXP for its application ready C2X solution, based on its leading performance, flexibility and scalability, and its ability to address various use cases and OEM requirements.”

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