Communications

Ethernet AVB chipset enables infotainment & telematics

7th January 2016
Nat Bowers
0

Designed to reliable multimedia transmissions for next-gen infotainment and telematics, Toshiba Electronics Europe has introduced an automotive-grade Ethernet bridge solution. The TC9560XBG supports standards such as IEEE 802.1AS and IEEE 802.1Qav, generally referred to as Ethernet-AVB.

The device has been developed under the ISO/TS 16949 and APQP automotive design quality system and is being AEC-Q100qualified to guarantee quality and performance in rigorous automotive environments. The TC9560XBG is housed in a 10x10mm LFBGA package.

When connected to an application processor or other SoC host, the TC9560XBG allows the host device to deliver audio, video and other data through the 10/100/1000 Ethernet network in an automotive environment. Connection to the host is via PCIe, HSIC or TDM/I2S for audio traffic. The chipset’s RGMII/RMII/MII interface connects to the Ethernet switch or PHY device and both AVB and legacy traffic are supported. An on-chip ARM Cortex-M3 processor performs system control and management.

Automotive electronics are becoming more complex with the addition of advanced sensors, high-resolution displays, on-vehicle cameras, ADAS and their data transmission and controls. Connecting these devices with an industry-standard Ethernet protocol allows for simplified wiring, cost savings, reduced harness weight and improved mileage.

Strategy Analytics forecasts that demand for automotive Ethernet will exceed 120m nodes by 2020, driven by increased in- and on-vehicle electronic content, including cameras, sensors, displays, safety systems and convenience solutions. In particular, for emerging autonomous vehicle systems, a reliable, high-speed communications network is an essential requirement.

In addition to the functionality offered by the TC9560XBG Ethernet bridge solution, the TC9560AXBG also provides automotive OEMs with access to CAN-FD functionality.

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier