Infineon Technologies AG is heralding a new era in power systems and energy conversion with the introduction of its advanced silicon carbide (SiC) MOSFET trench technology.

Infineon has announced its strategic collaboration with Qt Group for its TRAVEO T2G cluster microcontrollers.

Infineon has launched the new Automotive PSoC 4100S Max family supporting fifth-gen CAPSENSE technology.

Infineon Technologies AG is setting the course for ambitious growth by further strengthening and streamlining its sales organisation.

Infineon Technologies has unveiled its 750V G1 series of discrete CoolSiC MOSFETs, designed to cater to the growing requirements for enhanced efficiency and power density in both industrial and automotive power systems.

Infineon has agreed to sell its backend manufacturing facilities in Cavite, Philippines, and Cheonan, South Korea, to ASE Technology Holding, enhancing the strategic alliance between the two entities. 

Infineon Technologies has introduced the OPTIGA Trust M MTR for secure smart home devices.

Infineon announced the CYW20822-P4TAI040, it's latest Bluetooth module that pushes the low-power and range boundaries for wireless connectivity in IoT and consumer electronics.

Infineon has detailed its plans to highlight a broad range of power electronic devices during APEC 2024, 25–29 February.

VMAX has selected the new CoolSiC hybrid discrete with TRENCHSTOP 5 Fast-Switching IGBT and CoolSiC Schottky Diode from Infineon for its next-generation 6.6 kW OBC/DCDC on-board chargers.

Infineon has announced that Infineon and Honda have signed a Memorandum of Understanding (MoU) to build a strategic collaboration.

Infineon teams with Framework to launch an upgradeable, customisable, repairable laptop with advanced USB-C connectivity.

Infineon, in partnership with OMS and pmdtechnologies, has developed a new hybrid Time of Flight (hToF) solution that enables enhanced depth sensing and 3D scene understanding for next-generation smart consumer robots.

Infineon has announced it has received the ISO/SAE 21434 cybersecurity certification for its SLI37 automotive security controller family.

Infineon has announced its joint Innovation Application Centre in Shenzhen with Anker Innovations.

Infineon and Wolfspeed have announced the expansion and extension of their existing long-term 150mm silicon carbide wafer supply agreement, originally signed in February 2018.

Infineon and GlobalFoundries (GF) have announced a new multi-year agreement on the supply of Infineon’s AURIX TC3x 40 nanometre automotive microcontrollers as well as power management and connectivity solutions. The additional capacity will contribute to secure Infineon’s business growth from 2024 through 2030.

Infineon has launched the next-gen EZ-PD PAG2, a secondary-side controlled ZVS flyback converter chipset.

Infineon Technologies combines its expertise in magnetic position sensors with its linearised tunnel magnetoresistance (TMR) technology to launch the XENSIV TLI5590-A6W magnetic position sensor.

Infineon has announced its partnership with OMRON, combining Infineon’s GaN-based power solutions with circuit topology and control technology of OMRON.