New Low Profile, Quick Release Interconnect from Amphenol Offers High Performance
Amphenol Industrial Global Operations has introduced a low profile, quick release, high power interconnect using Amphenol’s new R4 RADSOK technology. The new RADLOK product line provides low insertion and extraction forces with a high mating cycle rating for high power interconnects, making it perfect for frequent mating applications.
This high performance connection system features a versatile, low profile, right angle design making it ideal for use in the automotive, heavy equipment, power/battery storage, hybrid-electric system, power interconnect and factory automation markets. An integrated positive mechanical lock/release feature enhances cycle durability.
Amphenol’s cost-effective RADLOK product line can be used as a battery interconnect both internally (cell-to-cell) and externally (battery-to-battery or array-to-power storage units); in electric vehicles, hybrid electric vehicles and fuel cell electric vehicles as well as in servers connecting power to the board.
RADLOK employs Amphenol’s unique R4 RADSOK technology that lowers voltage drop, maximizes contact surface and reduces temperature rise.
The connection system features a rugged, low-profile over mold design making it impact resistant. RADLOK is a preassembled 1 piece over mold connector that helps to reduce end user assembly costs. Color-coded for visual identification, the connectors are easy to install with a simple push and click.
These RoHS compliant connectors have a maximum current rating of 400A, a maximum DC voltage rating of 1,000 V and an operating temperature range of -40ºC to +125ºC. Available in either crimp-on versions or integrated directly onto cable with customizable lug end configurations.
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Panasonic PhotoMOS® Photovoltaic MOSFET High-Power Drivers
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| Stock: | 3490 |
| Cost: | $3.95 |
