Embedded NAND flash memory products for automotive applications

21st December 2016
Posted By : Alice Matthews
Embedded NAND flash memory products for automotive applications

The launch of Toshiba Corporation’s Storage & Electronic Devices Solutions's JEDEC e∙MMCTM Version 5.1 compliant embedded NAND flash memory products supporting AEC-Q100 Grade2 requirements has been announced. The line-up offers densities of 8, 16, 32 and 64GB. Sample shipments have already started with mass production scheduled for the second quarter (April-June) of 2017.

The products integrate NAND chips fabricated with 15nm process technology with a controller to manage basic control functions for NAND applications in a single package. As a complement to Toshiba’s previous product group of e∙MMC, which deliver the operating temperature range of -40 to 85°C required by car infotainment applications, the products support applications such as instrument clusters that require e∙MMC storage solutions to operate at higher temperatures up to 105°C.

In the automotive market, demand for NAND flash memory is continuing to grow alongside advances in car infotainment, ADAS and autonomous driving systems. Toshiba is meeting this demand by reinforcing its line-up of high performance and high density memory products and will continue to take leadership in the market.

Toshiba is also developing automotive UFS products that support AEC-Q100.


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