Around the Industry

Displaying 1371 - 1380 of 1428

Business ministers brought up to speed on Axeon electric vehicle battery technology

Vince Cable, Secretary of State for Business, Innovation and Skills, and Business Minister, Mark Prisk, were yesterday brought up to speed on Axeon’s industry-leading battery technology for electric vehicles, on display in the Low Carbon vehicle exhibition at the Department for Business, Innovation and Skills.
26th April 2011

New Automotive Centre of Excellence founded in Pune to foster automotive research and product development

NXP Semiconductors today inaugurated the Automotive Centre of Excellence (ACE) in Pune in association with the International Institute of Information Technology (I 2 IT). Located at I 2 IT Pune Campus,this Center of Excellence will provide unique infrastructure and collaboration of the industry and academia. The center will foster the innovation in the field of automotive electronics and would provide students, faculties, automotive Original Equipment Manufacturers (OEMs), automotive sub-assembly suppliers and industries in the region with expert technical support for product development and research activities to address market demands. In January 2011, NXP had announced an elaborate initiative called NXP ‘Anubhav’ to set up state-of-the-art labs at top engineering institutes in India and the Automotive Center of Excellence is a step in the direction. This is fifth lab as part of a plan to setup 20 labs across India under NXP “Anubhav” program.
26th April 2011

Renesas Electronics to Sell its U.S. Semiconductor Wafer Fabrication Facility to TELEFUNKEN Semiconductors

Renesas Electronics Corporation and TELEFUNKEN Semiconductors GmbH & Co. KG today announced that they have signed an agreement under which Renesas Electronics America Inc. will sell its semiconductor wafer fabrication facility in Roseville, California, to TELEFUNKEN Semiconductors International LLC, a company that includes TELEFUNKEN Semiconductors GmbH. The sale price is approximately 53 million U.S. dollars, and the closing for the sale is planned for May 2, 2011. Wafra Capital Partners L.P. and Somerset Capital Group Ltd. helped TELEFUNKEN finance and facilitate the transaction and ATREG Inc. advised Renesas throughout the transaction.
20th April 2011

Sysgo and OpenSynergy Join Forces For The Automotive Market

SYSGO AG and OpenSynergy GmbH have signed an exclusive cooperation agreement targeting the automotive market. They will join forces to provide carmakers with a software platform that already meets both avionics safety standards and AUTOSAR (Automotive Open System Architecture) requirements. Rolf Morich, general manager at OpenSynergy, said in a joint press release, “The high quality standards of SYSGO’s technology enable us to provide a universal operating system for carmakers and their suppliers, one that bridges the gap between car and consumer electronics while meeting the high safety standards of the avionics industry.”
20th April 2011

Freescale Semiconductor and Fuji Electric partner to increase efficiency of hybrid electric vehicles

Freescale Semiconductor has entered into a strategic alliance with Fuji Electric Co., Ltd. to collaborate on insulated-gate bipolar transistor (IGBT) technology and products for hybrid electric and electric vehicles (HEV and EV). Working with Fuji Electric, Freescale will add high-power IGBT products to its existing portfolio of solutions for electronic powertrain applications, market those products to its automotive customers and define and produce new products based on customer input.
19th April 2011

NXP Ships 500 Millionth ABS Sensor Module

NXP Semiconductors N.V. today announced that it has shipped more than half a billion ABS speed sensor modules – a key milestone in NXP’s relationship with Continental, one of the leading global automotive suppliers. The Chassis & Safety Division of Continental has worked closely with NXP to develop advanced ABS/ESC sensor modules that are now used by most car manufacturers in the world, in both the standard and high-end segments of the market.
19th April 2011

Daimler and Bosch to establish joint venture for electric motors

Daimler AG and Robert Bosch GmbH plan to expand their long-standing partnership and cooperate in the development and production of electric motors for all-electric vehicles in Europe. The companies have signed a letter of intent and begun negotiations to establish a 50:50 joint venture that should be concluded in the first half of 2011.
13th April 2011

Ansys Info Day

Designing Better Hybrid Electric Vehicles with Numerical Simulation 10th May 2011 Heritage Motor Centre Gaydon, Warwickshire
13th April 2011

10-years Technology Partnership between Thales and TTTech

Thales, leader in railway signalling solutions and integrated transportation systems, and TTTech, the leading supplier of dependable networking solutions based on time-triggered technologies, announce their continued partnership for the next generation of silicon technology. The two companies look back on a successful cooperation in the railway sector for more than 10 years. The major goal of the joint project was the usage of a customer-specific controller solution for interlocking systems. This solution is based on TTP, a protocol bus for highly available and fault-tolerant systems, increasing safety of train services
13th April 2011

NXP Relocates Automotive Sales and Marketing Headquarters to Shanghai and Establishes New Automotive Technical Center in China

Today, NXP Semiconductors made two major announcements underscoring its commitment to the growing automotive market in China. NXP has established a new China Automotive Technical Center to focus on R&D, system innovation and customer application support, and has also moved its Automotive sales and marketing headquarters to Shanghai.
13th April 2011

Around the Industry documents

Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

ELIV 2019
16th October 2019
Germany Bonn World Conference Center