Next generation of automotive board edge connectors: high speed with 230 contacts for MXM applications

1st August 2013
Posted By : Raj Joshi
Next generation of automotive board edge connectors: high speed with 230 contacts for MXM applications

With the new high-speed BEC and optional power connector, Yamaichi Electronics has expanded its product family for automotive and other demanding applications. About three years ago marked the beginning of the success story of the BEC (Board Edge Connector), the first connector with 230 pins and a pitch of 0.5 mm for modules meeting the MXM and Qseven standards that has been developed and tested specifically for automotive applications.

However, since requirements are continually getting ever more demanding, especially in the area of data transmission rates, Yamaichi Electronics has now taken the next step towards the future of high speed. A connector with identical outer dimensions has been developed, with the same pin count and pitch, and a nearly identical footprint layout, but with the capability of transmitting data supporting formats like USB3.0, HDMI or PCI Express 2.0.

This was possible due to a basic redesign of the contacts and further development of the insulation body. The connector also continues to meet the requirements of the automotive sector and is therefore also suitable for other demanding applications.

For example, the contacts have the characteristics needed to ensure stable contact force even when subject to vibrations and shock. The spring characteristic of the contacts also permits tolerance compensation and reliable data transmission if modules with dimensions close to the tolerance limits are used.

One feature of the high-speed BEC, just as for its predecessor model, is the side extensions of the insulation body which not only fasten the SMT tabs but also have a threaded seam on both sides that offers the option for additional fastening of the module card. The module card can thus be screwed to the connector using screws.

The larger SMT tabs are used for the ground connection and for the SMT connection – along with the 230 contacts – to the motherboard.

Yamaichi Electronics has thus managed to combine high-speed requirements and robustness into a single unique system.

The connector is available with different platings, e.g. Gold Flash, 15 and 30µinch gold in the contact area. It is packaged and delivered in T&R. Fabrication is nearly entirely automated. The automated, 100% inspection ensures consistent, stable quality.

As a possible option, Yamaichi Electronics offers a power connector that rounds out the board edge family. In the case that all 230 contacts of the high-speed BEC are used for signal transmission (230x0.5A), the power connector can supply the power needed. Used on the side of the module opposite the HS-BEC, 10 contacts provide 1.5A each. The power connector contacts the module on the bottom of the module.

For assembly, the module is first pushed into the BEC or high-speed BEC, then pushed downwards. The power connector is equipped with a ratcheting spring that fastens the module and simplifies handling before the remainder of the processing procedure. The power connector also has threaded seams pressed into the sides near the SMT tab that can be used for screw fastening of the module to the power connector.

The customer thus has the option of guaranteeing data and power supply at the highest level while still getting the smallest possible form factor.

Soldering is also done using the SMT process over the 10 pins and two SMT tabs. The connector is available in different platings, such as Gold Flash, 15 and 30µinch gold in the contact area. It is delivered and packaged in T&R.



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