Lighting

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Renesas Electronics Introduces Three New Intelligent Power Devices for Automotive Lighting Applications

Renesas Electronics Introduces Three New Intelligent Power Devices for Automotive Lighting Applications
Renesas Electronics America Inc today announced three new intelligent power devices (IPDs), the µPD166011, µPD166013 and µPD166014, for use in automotive lighting systems for turn signals and brake light applications. The new IPDs integrate into a single package, power metal-oxide-semiconductor field-effect transistors (Power MOSFETs) as switching elements and control circuits for protection and self-diagnostic functions.
1st June 2011

Innovative automotive illumination solutions use LED-based edge lighting technology

LED-based edge-lit illumination from Global Lighting Technologies (GLT) offers an array of innovative and highly efficient solutions for automotive lighting from backlit dashboard displays to interior and exterior lighting.
25th May 2011

Philips Lumileds SnapLED Takes Automotive Lighting to the Next Level with ‘Build Out of the Box’ capability

SnapLED, the automotive industry’s most widely used LED for signaling applications, has been significantly improved by Philips Lumileds. With a continued focus on reliability and performance, engineers have raised junction temperature maximums, narrowed color binning to levels imperceptible by the human eye, dual-binned for drive current to simplify the design process and make it easier to meet critical regulation requirements, and implemented a new Multi-Environment Over Stress Test (MEOST) regimen to ensure SnapLED is the most reliable automotive LED.
17th May 2011


Intersil Introduces Industry's First High Temperature Digital Ambient Light Sensor for In-Vehicle Lighting Applications

Intersil Corporation today introduced the industry's first automotive grade ambient light sensor designed to support continuous operation up to 105 degrees Celsius. The ISL76683 is qualified to the Automotive Electronics Council's AEC-Q100 grade 2, assuring reliability under significant thermal stress. It also maintains package transparency under automotive thermal stress, solving a known issue with existing sensors.
5th April 2011


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