Infotainment

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Reference designs simplify automotive infotainment

Reference designs simplify automotive infotainment
Making it easier for designers to learn and implement MOST technology in automotive infotainment systems, Microchip has introduced the MOST ToGo Reference Designs. These reference designs enable designers to leverage Microchip’s extensive experience of the vast MOST specifications, allowing them to focus on their application software development.
22nd July 2014

Cadence and QNX Announce New Tensilica HiFi Audio/Voice DSP Application for In-Car Active Noise Control

Cadence Design Systems, Inc announced that QNX has ported its QNX Acoustics for Active Noise Control (ANC) software to the Cadence Tensilica HiFi Audio/Voice digital signal processing (DSP) core. The Tensilica HiFi Audio/Voice DSP from Cadence is available immediately. 
26th June 2014

Melexis brings 3D vision to automotive infotainment

Melexis brings 3D vision to automotive infotainment
Melexis and SoftKinetic announce the first time of flight (ToF) 3D sensor for automobile safety and infotainment markets. The MLX75023 sensor, featuring SoftKinetic technology and manufactured in Melexis’ Automotive grade CMOS mixed signal process, is the highest resolution 3D sensor available. It works in full sunlight, making it a suitable solution for a vehicle’s cockpit.
25th June 2014


Fanless embedded system targets car PC applications

Fanless embedded system targets car PC applications
DFI launches the EC700-BT embedded system that supports the low-power and high-performance Intel Atom processor E3800. It is a perfect combination of impressive fashion design and excellent computing capability, bringing a new art concept to the industrial automation market. Aimed at Car PC application, you can replace the hard drive with a DC to DC Car PC module that supports ACC feature, and use mSATA for data storage support.
24th June 2014

CSR Selects Cadence Palladium XP Platform for Development of ARM-based Automotive Infotainment Systems

Cadence Design Systems Inc announced that CSR plc selected the Cadence Palladium XP verification computing platform for system and early firmware validation of ARM-based automotive infotainment systems-on-chip (SoCs). Using Palladium Hybrid technology, CSR experienced a 200X speed-up for OS bringup, which shaved months off the development cycle. 
19th June 2014

DFI’s Qseven Module Based on the Freescale i.MX6 Processor Targets Automotive Application

DFI’s Qseven Module Based on the Freescale i.MX6 Processor  Targets Automotive Application
DFI launches a new Qseven module, FS700, which is powered by the latest Freescale i.MX6 processor. By combining power-efficient processing capabilities of the ARM Cortex-A9 architecture, with bleeding edge 3D and 2D graphics as well as high-definition video, the FS700 module provides a new level of multimedia performance to enable an unbounded next-generation user experience.
19th June 2014

AEC-Q101 qualified proximity & ambient light sensor

AEC-Q101 qualified proximity & ambient light sensor
An AEC-Q101-qualified, fully integrated proximity and ambient light optical sensor with an industry-high operating temperature range to +105°C was announced by Vishay. The VCNL4020X01 combines an IR emitter, a photo-pin-diode for proximity, an ambient light detector, a signal processing IC, and a 16-bit ADC in one small 4.8x2.3x0.8mm rectangular lead-less (LLP) package.
18th June 2014

Wireless connectivity for automotive infotainment

Wireless connectivity for automotive infotainment
Texas Instruments has started mass production of what the company claims to be the world’s most advanced automotive-grade wireless connectivity devices, the WiLink 8Q family. The family integrates WiFi, Bluetooth, Bluetooth Low Energy and GPS/GNSS technologies into an AEC-Q100 qualified wireless connectivity chip for automotive infotainment systems.
16th June 2014

Jacinto 6 processor enhances in-vehicle infotainment

Jacinto 6 processor enhances in-vehicle infotainment
The newest member of Texas Instruments' Jacinto platform, the DRA72x “Jacinto 6 Eco” SoC has been introduced. Manufacturers can use the DRA72x processor to cost-effectively integrate and deliver high-integrity audio, simultaneous multimedia streaming and device connectivity in a wide range of automobiles, including the burgeoning entry- to mid-level segment.
13th June 2014

Wireless MCU simplifies automotive connectivity

Wireless MCU simplifies automotive connectivity
Delivering low power, low cost and simplified automotive connectivity to emerging smartphone-controlled and wire-replacement applications, Texas Instruments introduce the SimpleLink Bluetooth low energy CC2541-Q1. The CC2541-Q1 leverages the success of TI’s broad-market Bluetooth Smart solution (SimpleLink CC2541) and automotive connectivity offerings for combo WiFi, Bluetooth and GNSS (WiLink 8Q) and dual-mode Bluetooth (BL6450Q).
24th April 2014


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