Infotainment

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Platform utilises SoCs for the 'true' connected car

Support for the Renesas R-Car M2 and Renesas R-Car H2 SoCs is now available from Cinemo. Enabling video hardware acceleration with extremely low CPU loads, Cinemo’s multimedia platform utilises the R-Car M2 and H2 architecture for Blu-Ray and Full HD video playback, streaming, ultra-fast media management, connectivity, and full Rear Seat Entertainment (RSE).
7th October 2014

2A buck regulator suits audio & infotainment systems

2A buck regulator suits audio & infotainment systems
  A high-efficiency converter targeted at the automotive and industrial markets, the A8585 has been announced by Allegro MicroSystems. The 2A buck regulator has been designed to provide the low power supply requirements of next-gen car audio and infotainment systems.
14th August 2014

Devices drive in-vehicle infotainment experience

Devices drive in-vehicle infotainment experience
Targeting the advancement of infotainment and user driving experience in the automobile, Texas Instruments has introduced seven power management, SuperSpeed USB and logic products. The products released include a PMIC for infotainment systems, a free-positioning Qi wireless power transmitter and, what the company claims is, the industry’s first USB 3.0 devices.
6th August 2014


Lean networks for HD multimedia

Deployment in over 150 models worldwide demonstrates how MOST has succeeded in high-end infotainment systems. Now the networking standard has started making inroads into middle and lower automobile sectors, targeting compact and sub-compact class cars. By Rainer Klos, Administrator, MOST Cooperation.
6th August 2014

Reference designs simplify automotive infotainment

Reference designs simplify automotive infotainment
Making it easier for designers to learn and implement MOST technology in automotive infotainment systems, Microchip has introduced the MOST ToGo Reference Designs. These reference designs enable designers to leverage Microchip’s extensive experience of the vast MOST specifications, allowing them to focus on their application software development.
22nd July 2014

Cadence and QNX Announce New Tensilica HiFi Audio/Voice DSP Application for In-Car Active Noise Control

Cadence Design Systems, Inc announced that QNX has ported its QNX Acoustics for Active Noise Control (ANC) software to the Cadence Tensilica HiFi Audio/Voice digital signal processing (DSP) core. The Tensilica HiFi Audio/Voice DSP from Cadence is available immediately. 
26th June 2014

Melexis brings 3D vision to automotive infotainment

Melexis brings 3D vision to automotive infotainment
Melexis and SoftKinetic announce the first time of flight (ToF) 3D sensor for automobile safety and infotainment markets. The MLX75023 sensor, featuring SoftKinetic technology and manufactured in Melexis’ Automotive grade CMOS mixed signal process, is the highest resolution 3D sensor available. It works in full sunlight, making it a suitable solution for a vehicle’s cockpit.
25th June 2014

Fanless embedded system targets car PC applications

Fanless embedded system targets car PC applications
DFI launches the EC700-BT embedded system that supports the low-power and high-performance Intel Atom processor E3800. It is a perfect combination of impressive fashion design and excellent computing capability, bringing a new art concept to the industrial automation market. Aimed at Car PC application, you can replace the hard drive with a DC to DC Car PC module that supports ACC feature, and use mSATA for data storage support.
24th June 2014

CSR Selects Cadence Palladium XP Platform for Development of ARM-based Automotive Infotainment Systems

Cadence Design Systems Inc announced that CSR plc selected the Cadence Palladium XP verification computing platform for system and early firmware validation of ARM-based automotive infotainment systems-on-chip (SoCs). Using Palladium Hybrid technology, CSR experienced a 200X speed-up for OS bringup, which shaved months off the development cycle. 
19th June 2014

DFI’s Qseven Module Based on the Freescale i.MX6 Processor Targets Automotive Application

DFI’s Qseven Module Based on the Freescale i.MX6 Processor  Targets Automotive Application
DFI launches a new Qseven module, FS700, which is powered by the latest Freescale i.MX6 processor. By combining power-efficient processing capabilities of the ARM Cortex-A9 architecture, with bleeding edge 3D and 2D graphics as well as high-definition video, the FS700 module provides a new level of multimedia performance to enable an unbounded next-generation user experience.
19th June 2014


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