Provider of customisable smart connectivity solutions, Lattice Semiconductor, has announced the availability of seven new modular IP cores for its award winning CrossLink FPGA product for increased design flexibility to support consumer, industrial and automotive applications. These modular IP cores offer the building blocks for customers to create their own video bridging solutions.
The mobile industry, through its demand for high volumes and exceptional performance, has created video components such as processors, displays, and sensors that are valued in other 'mobile-influenced' markets. These markets demand cost-effective devices that bridge between MIPI and other traditional or legacy display and camera interfaces.
“Our customers are asking for FPGAs with MIPI D-PHY capability to solve increasingly difficult video interface problems. Too often, they reach barriers with solutions that miss the mark on power efficiency, size and performance,” said Tom Watzka, Product Marketing Manager at Lattice Semiconductor. “For more than a year, Lattice’s CrossLink devices and its portfolio of IP cores have delivered the tools needed to overcome these challenges. These new IP cores add to an already robust suite of tools to support quickly evolving intelligence at the edge applications.”
Announced in May 2016, the CrossLink product was designed to address barriers faced by the increasingly complex and dynamic video market. Lattice equipped designers with a new way to deliver low power and compact bridging solutions without compromising performance to deliver innovations for multiple growth markets including automotive, AR/VR and drones.
The new CrossLink modular IP cores include:
In addition, Lattice has included a 1:2 MIPI DSI Display Interface Bandwidth Reducer, which utilises select modular IP cores above to bridge an input video stream into two streams or one lower resolution stream.