Automotive-grade LIN SIP solution has touch hardware support

27th October 2016
Posted By : Alice Matthews
Automotive-grade LIN SIP solution has touch hardware support

An automotive-grade Local Interconnect Network (LIN) System in Package (SiP) solution with integrated touch hardware support has been announced by Microchip. The SAMHA1GxxA microcontroller family contains capacitive touch hardware support, an event system and complex PWM capability. 

The series is useful for touch button, touchpad, slider, wheel or proximity sensing applications, including optical and haptic feedback.

The SAMHA1GxxA contains an ARM Cotex-M0+ microcontroller (MCU), a LIN transceiver based on Microchip’s fourth-generation LIN IP and a voltage regulator. The system solution comes in a 7×7mm QFN package, with wettable flanks ready for automatic optical solder inspection and is available with 16, 32 or 64k Flash memory, up to 8KB SRAM and 2kB read-while-write Flash.

The microcontroller family is automotive grade and designed to meet the high quality standards of the automotive industry. It features easy-to-create touch buttons with high sensitivity and outstanding noise immunity, supported by our QTouch software function library. High ElectroMagnetic Compatibility (EMC) robustness of the LIN communication is fulfilling the requirements of OEMs worldwide.

To accelerate development, Microchip provides the SAMHA1G16X-XPRO development kit which includes support from Atmel Software Framework (ASF). The SAMHA1GxxA device is implemented in the Atmel Studio 7 integrated development environment. Various tools like GCC and IAR C/C++ compilers, ICE debuggers and a QTouch software function library are also available.

Key features:

  • SAMHA1GxxA contains microcontroller, LIN transceiver and a voltage regulator
  • Easily implements touch controls with high sensitivity and outstanding noise immunity
  • Enables touch-button, slider, wheel or proximity-sensing applications
  • Supported by QTouch software function library and a dedicated development board 

You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

act! 2017
28th September 2017
Germany NHOW Berlin
ELIV 2017
18th October 2017
Germany Bonn World Conference Center
TU-Automotive Europe 2017
6th November 2017
Germany Munich
Smart Mobility Executive Forum
12th February 2018
Germany Berlin